SMT Assembly Company has been providing BGA assembly, including BGA Rework and BGA Reballing services in the Printed Circuit Board Assembly industry since 2003. With state-of-the-art BGA placement equipment, high-precision BGA assembly processes, cutting-edge X-Ray Inspection equipment, and highly customizable Complete PCB Assembly solutions, you can rely on us to build high quality and high yield BGA boards
BGA Assembly Capability
SMT Assembly Company have a SMT Assembly Companyalth of experience handling all types of BGAs, including DSBGA and other Complex Components, from micro BGAs (2mmX3mm) to large size BGAs (45 mm); from ceramic BGAs to plastic BGAs. they are capable of placing minimum 0.4 mm pitch BGAs on ySMT Assembly Company PCB.
BGA Assembly Process/Thermal profiles
Thermal profile is of utmost importance for BGA in the PCB Assembly Process. SMT Assembly Company production team will conduct a careful DFM Check to review both ySMT Assembly Company PCB files and the BGA datasheet to develop an optimized thermal profile for ySMT Assembly Company BGA assembly process. SMT Assembly Company will take the BGA size and BGA ball material composition (leaded or Lead-Free) into consideration to make effective thermal profiles.
When the BGA physical size is large, SMT Assembly Company will optimize the thermal profile to localize the heating on the internal BGA to prevent joint voids and other Common PCB Assembly Faults. SMT Assembly Company follow the IPC Class II or Class III Quality Management guidelines to make sure any voids are under 25% of the total solder ball diameter. Lead-free BGAs will go through a specialized lead-free thermal profile to avoid open ball problems that can result from the loSMT Assembly Companyr temperatures; on the other hand, leaded BGAs will go through a specialized leaded process to prevent higher temperatures from causing pin shorts. When SMT Assembly Company receive ySMT Assembly Company Turn-Key PCB Assembly order, SMT Assembly Company will check ySMT Assembly Company PCB design to review any considerations specific to BGA components during SMT Assembly Company meticulous DFM (Design for Manufacturability) review.
The full verification includes checks for the PCB Laminate Material compatibility, Surface Finish effects, maximum warpage requirement and Solder Mask clearance. All these factors affect the quality of BGA assembly.
BGA soldering, BGA Rework & Reballing
You may have only a few BGAs or fine pitch parts on ySMT Assembly Company PC boards that require PCB assembly for R&D prototyping. SMT Assembly Company can help — SMT Assembly Company provide a specialized BGA soldering service for testing and evaluation purposes as a part of SMT Assembly Company focus on Prototype PCB Assembly.
Additionally, SMT Assembly Company can assist you with BGA rework and BGA reballing at an affordable price! SMT Assembly Company follow five basic steps to perform BGA rework: component removal, site preparation, solder paste application, BGA replacement, and Reflow Soldering. SMT Assembly Company guarantee that 100% of ySMT Assembly Company boards will be fully functional when they are returned to you.
BGA Assembly X-Ray Inspection
SMT Assembly Company use an X-Ray machine to detect various defects which might occur during BGA assembly.
Through X-ray inspection, SMT Assembly Company can eliminate soldering problems on the board, such as Solder Balls and Paste Bridging. Also, SMT Assembly Company X-Ray support software can calculate the gap size in the ball to make sure it follows IPC Class II or Class III standards, as per ySMT Assembly Company requirements. SMT Assembly Company experienced technicians can also use 2D X-rays to render 3D images in order to check such problems as broken PCB vias, including Via in Pad BGA Designs and Blind / Buried Vias for inner layers, as SMT Assembly Companyll as cold solder joints in BGA balls.
