Feature
High-end double-sided online automatic optical inspection machine TY-A900
Precision optical imaging
Double-sided structure: cameras on both sides move at the same time, capture images at the same time, and detect both sides at the same time, achieving ultimate speed while ensuring the imaging effect.
Telecentric lens: shoots images without parallax, effectively avoids reflection interference, minimizes tall components, and solves the problem of depth of field
Industrial cameras take high-speed images and capture high-definition images
Three-color tower light source RGB three-color LED and multi-angle tower-shaped combination design can accurately reflect the slope level information of the object surface
Collinearity: The backplane LED light strip needs to detect the relative offset of two LEDs to ensure that the entire LED light strip is collinear, which perfectly solves the industry problem of S-type non-collinear LED distribution testing, which is achieving non-adjacent LED collinearity analysis and judgment.
Resistor value identification: This algorithm uses the latest machine identification technology to calculate the precise resistance value and electrical characteristics of the resistor by identifying the characters printed on the resistor. This algorithm can be used to detect wrong parts of the resistor, and at the same time realize automatic matching of "substitute materials" function.
Scratch detection: This algorithm will search for dark stripes of specified length in the target area and calculate the average brightness value of the dark stripe area. This algorithm can be used to detect scratches, cracks, etc. on flat surfaces.
Intelligent judgment: This algorithm collects various qualified and bad image samples respectively, establishes an intelligent judgment mode through training, and calculates the similarity of the images to be tested. This algorithm simulates the human thinking mode and can solve some problems that are difficult to detect with traditional algorithms. Take it easy. For example: wave solder joint detection, reset solder ball detection, polarity detection of circular components, etc.
Detail Image
Specifications
| Optical system | optical camera | 5 million high-speed intelligent digital industrial cameras (optional 10 million) |
| Resolution (FOV) | Standard 10μm/Pixel (corresponding to FOV: 24mm*32mm) 10/15/20μm/Pixel (optional) | |
| optical lens | 5M pixel level telecentric lens | |
| Light source system | Highly bright RGB coaxial annular multi-angle LED light source | |
| Hardware Configuration | operating system | Windows 10 Pro |
| Computer Configuration | i7 CPU, 8G GPU graphics card, 16G memory, 120G solid state drive, 1TB mechanical hard drive | |
| Machine power supply | AC 220 volts ±10%, frequency 50/60Hz, rated power 1.2KW | |
| PCB direction | Can be set to left → right or right → left by pressing the button | |
| PCB plywood method | Automatic opening or closing of double-sided clamps | |
| Z-axis fixation method | 1 track is fixed, 2 tracks are automatically adjustable | |
| Z-axis track adjustment method | Automatically adjust width | |
| conveyor height | 900±25mm | |
| air pressure | 0.4～0.8Map | |
| machine dimension | 1050mm*1120mm*1830mm (L*W*H) Height does not include alarm light | |
| machine weight | 600kg | |
| Optional configuration | Offline programming software, external barcode gun, MES traceability system interface open, maintenance station host | |
| Up and down detection method | Optional: enable upper detection alone, lower detection alone or upper and lower detection simultaneously. | |
| PCB specifications | PCB size | 50*50 mm ~ 450*380 mm (larger sizes can be customized according to customer requirements) |
| PCB thickness | 0.3~6mm | |
| PCB board weight | ≤3KG | |
| Net weight | Upper clear height ≤ 40mm, lower clear height ≤ 40mm (special requirements can be customized) | |
| Minimum test element | 01005 components, 0.3 mm pitch and above IC | |
| Test items | Solder paste printing | Presence or absence, deflection, less tin, more tin, open circuit, pollution, connected tin, etc. |
| Part defects | Missing parts, offset, skewed, tombstones, sideways, overturned parts, reverse polarity, wrong parts, damaged, multiple parts, etc. | |
| Solder joint defects | Less tin, more tin, continuous tin, virtual soldering, multiple pieces, etc. | |
| Wave soldering inspection | Inserting pins, Wuxi, less tin, more tin, virtual soldering, tin beads, tin holes, open circuits, multiple pieces, etc. | |
| Red plastic board detection | Missing parts, offset, skewed, tombstones, sideways, overturned parts, reverse polarity, wrong parts, damage, glue overflow, multiple parts, etc. |
