Mea hoʻolako ʻoihana SMT Solution

E hoʻoholo i nā nīnau āu e pili ana iā SMT
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ʻO ka nānā ʻana a me nā ana hoʻohaʻahaʻa haʻahaʻa

E like me ka Sn mea i loaʻa ma mua o 95% i loko o ka SnAgCu alakai-noa solder , pela i ka hoohalike ana me ka kuʻuna solder , ka mahuahua ana o na mea o Sn a me ka mahana o Lead-free soldering kaʻina e alakai i ka oxidation o ka solder mahuahua. e ho'ēmi i ka oxidation o solder slag, dross, pono mākou e hoʻomaopopo mua i nā ʻano a me nā kaʻina hana.

 

E noonooia keia mau mea ekolu.

(1) ʻO ka ʻili paʻa o ke kiʻi oxide, he ʻano kūlohelohe kēia o Sn oxide, ʻoiai ʻaʻole i haki ke kiʻi oxide, no ka mea e pale aku i ka hana hou ʻana o ka nui o ka oxidation.E like me ka mea i hōʻike ʻia ma lalo nei:

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(2) ʻO ka pauka ʻeleʻele, ma muli o ka friction o ke kiʻi kiʻekiʻe rotating impeller shaft a me Sn oxide film, ʻo ia ka hana spheroidizing huahana, a ʻoi aku ka nui o nā ʻāpana.E like me ka mea i hōʻike ʻia ma ke kiʻi ma lalo nei:

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(3)Bean curd koena, aia i loko o ka nozzle periphery o turbulent nalu a me ka maluhia nalu, helu no ka nui loa o ka holoʻokoʻa o ka oxide slag.

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ʻO ke koena bean curd i hoʻokumu ʻia e ka oxygen kaomi maikaʻi ʻole i ka shear slag, a me ka hopena o ka wailele i ka hopena hui ʻana o nā kumu like ʻole, ʻo ke kaʻina hana kūikawā penei:

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ʻO ka ʻāpana ʻeleʻele ka lewa, ʻo ka mahana wai e hāʻule keʻokeʻo Sn.t = t3 huahelu hiki iā mākou ke ʻike i kahi ʻāpana liʻiliʻi o ka ea i ale ʻia i ka solution solder, ʻo kahi ʻāpana liʻiliʻi o ka ea ma muli o ka wikiwiki o ka oxygen i loko o ka pahu e ʻike ʻia akā ʻaʻole hiki ke hoʻopau i ke kinoea N2, a no laila e hana ʻia nā pōpō puhaka. , No ka mea, ʻoi aku ka liʻiliʻi o ka mānoanoa o ka poepoe ʻōpuʻu ma mua o ko ke tini, pono e puka mai ka ʻili o ke kini i ka wā i hoʻopaʻa ʻia ai kēia mau pōpō puha e lana ana ma ka ʻili o ke koena Bean curd.

I ka ʻike ʻana i nā kumu a me nā ʻano mea hana tin, ke manaʻoʻiʻo nei mākou ʻo ka hoʻohaʻahaʻa ʻana i ke koena o ka Bean curd e hōʻemi i nā hana ʻoi loa.Mai ka mea i luna aʻe hiki ke ʻike ʻia ke kaʻina hana ikaika: ʻelua mau kūlana kūpono ka hollow o nā pōpō solder:

ʻO ka mea mua e pono ai ka hopena palena, ka ʻili o ka tin me kahi roll dramatic, e hana ana i ka phagocytosis.

ʻO ka lua o ke koi ʻana he pōpō puʻu i loko e hana i kahi kiʻiʻoniʻoni oxide nui, ua hoʻokumu ʻia ke kinoea nitrogen i loko o ka pā.Inā ʻaʻole, lana ia ma ka ʻili o ka solder i ka wā e haki ʻia ai ka pōleʻa hollow, ʻaʻole hiki ke hana i kahi "koena bean curd."
ʻO kēia mau kūlana kūponoʻelua he mea nui.

ʻO nā ana o ka hōʻemi ʻana i ka lepo i ka nalu ʻana e hōʻike ana penei:

1. E ho'ēmi i ke āpau i hanaʻia i ka wā e hoʻololi ai i ka nalu, e ho'ēmiʻia ka reflow solder bump ho'āʻo e ho'ēmi i ka'ōwili, a laila e ho'ēmi i ka hanauna o ka phagocytosis.

No laila, hoʻololi mākou i ka ʻāpana keʻa o ka ipu hao i loko o kahi trapezoid, a hana i ka nalu mua i kahi kokoke loa i ka lihi o ka ipu hao.

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2. Ma ka nalu mua a me ka nalu ʻelua, hoʻohui mākou i ka mea pale i kānana ʻole ʻia i ka solder tumbling-flow.

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3. E lawe i ka pale N2 e pale aku i ka hana ʻana o nā membrane oxide nui i ka pōlele solder.


Ka manawa hoʻouna: Mar-22-2022