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SMT Solder talea et filum

SMT Solder talea et filum Featured imago
  • SMT Solder talea et filum
  • SMT Solder talea et filum
  • SMT Solder talea et filum

Description:

Exemplar productum album:

Categoria Exemplar Alloy (%) Temperatus liquescens (°C) Filum minimum diameter (mm) Series plumbi liberorum mixturae
TYtech-601A Sn96.5/Ag3.0/Cu0.5 217-219 0.14 (including resinam)
TYtech-601C Sn985/Agl.0/Cu0.5 227-229 0.11 (including resinam)
TYtech-608A Sn99/Ag03/Cu0.7 227-229 0.11 (including rosinam)
TYtech 608B Sn98.8/Ag0.5/Cu0.7 227-229 0.11 (including resinam)
TYtech-601E Sn96.5/Ag3.S 217-219 0.11 (including rosinam)
TYtech-601D Sn97/Ag3.0 227-229 0.11 (including resinam)
TYtech-608C Sn99.5/Ag0.5 227-229 0.11 (including rosinam)
TYtech-601B Sn99.7/Ag03 227-229 0.11 (including rosinam)
TYtech-603C Sn99.3/Cu0.7 227 0.11 (including resinam)
TYtech-609A Sn42/Bi58 138TBD
TYtech-609E Sn90/$bl0 250 0.11 (including spacer)
Allygium plumbum series
TYtech-60/40 Sn60/Pb40 183 .0,3 (including rosin)
TYtech-63/37 Sn63/Pb37 183 0.3 (including resinam)
TYtech-10/90 Snl0/Pb90 302 0.3 (including resinam)

Product Detail

Product Tags

Productum lineamenta et commoda:

Ieiunium udus: Abbreviare cyclum tempora pro encapsulation manuali et operationes reparationis componentis.
Flux Spatter minimal: Tutus et facilis uteris cum residuo tabula minimal.
Bonae notae diffusio: articulatio solida optima, rate primum passiva, dilatatio capacitatis ≥ 80% (secundum JIS vexillum).
Low Smoke Levels: Mundus labor ambitus et fumus deminuti pertractatio.
Patet, residua non viscosa: nulla residua ad omnes operationes mundas.
Bona species condo: facilius visualium inspectione
Halogen-liberum et halide-liberum: occursum requisita environmental et altae electricae constantiae.

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