Feature
MS-11 series is a inline 3D SPI machine which inspects the solder amount status after the solder is spread to clearly grasp the process. With a 25 Megapixel camera contributing to productivity enhancements, 0201(mm) size solder paste inspection is possible.
Dual Projection Probe
To reduce the error caused by the shadows then imaging high components with single projection, the dual projection probe is applied. With precise and accurate 3D measurement when imaging high components distorted measurements possiblility due to shadowing effects are completely eliminated.
- Dual projection to completely solve deffused refelection shadowing problem
- A combination of images from opposite direction for a complete volume measurement
- Perfect and precise 3D measurement capability
The World's First High Resolution 25 Megapixel Camera
We are proud to have applied the next generation vision system with 25 Megapixel high resolution camera for more precise and stable inspection and the world's only high speed CoaXPress transmission method to allow 4 times more date transmission and 40% increased process speed.
- The world's only 25 Megapixel camera loaded
- CoaXPress high performance vision system applied
- Large FOV to increase inspection speed
- Processing speed increased by 40% compared to Camera Link
Warpage-free Inspection System
SPI machine detects the warpasge of PCB within FOV while it captures board image, and automatically compensate it, so that bent PCBs can be inspected without any problem.
- Bent PCB inspection without Z-Axis movement
- Inspection capability from ±2mm to ±5mm (depending on Lens)
- More accurate 3D results guaranteed.
Detail Image
Specifications
