Wave soldering machine is a commonly used soldering method in PCB manufacturing, but sometimes there will be bridging problems, resulting in poor appearance and reduced electrical performance. Bridging refers to the formation of continuous solder bridges or solder joints on the surface of the PCB, which affects the electrical performance and appearance of the PCB. In order to solve the problem of bridging in wave soldering, we can take the following methods:
1. Adjust the wave crest height: The wave soldering machine needs a suitable height, which is determined by the thickness and material of the PCB. If the wave crest height is too high, the solder will easily form bridges during the flow process; if the wave crest height is too low, the PCB may contact other metal surfaces, resulting in bridging. Therefore, we need to check the wave crest height regularly and adjust it according to the actual situation.
2. Optimize flux: Flux is an essential auxiliary material in wave soldering. It can remove oxides on the surface of PCB and control the flow and solidification process of solder. If the concentration of flux is too high or too low, or the type is not suitable, it may cause soldering problems. Therefore, we need to select the appropriate flux according to the material and welding requirements of PCB, and test its concentration regularly.
3. Improve PCB design and manufacturing process: When designing PCB, we need to consider factors such as circuit layout and heat dissipation to avoid solder joints between adjacent circuits. At the same time, we can also use methods such as adding solder mask and solder mask to prevent the metal parts on the PCB surface from contacting. During the PCB manufacturing process, we need to ensure the flatness and cleanliness of the PCB to avoid oxidation or dirt on the metal surface.
4. Add baffles: Adding baffles in wave soldering can effectively prevent solder joints between PCBs. The baffle can be a metal plate or a plastic plate. Its height needs to be higher than the wave crest height and it needs to be kept at a certain distance from the PCB. The baffle can effectively prevent solder joints between PCBs.
5. Improve the soldering process: In wave soldering, we can use appropriate soldering temperature and time to control the bridging problem. If the soldering temperature is too high or the time is too long, it may cause PCB deformation or aggravate bridging; if the soldering temperature is too low or the time is too short, it may not meet the soldering requirements. Therefore, we need to select appropriate soldering process parameters according to the actual situation.
Post time: Oct-10-2024
