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The difference between reflow oven and wave soldering.
1. Wave soldering is a process in which molten solder forms a solder wave to solder components; reflow soldering is a process in which high temperature hot air forms reflow melting solder to solder components. 2. Different processes: Flux should be sprayed first in wave soldering, and then throug...Read more -
What aspects should be paid attention to in the reflow soldering process?
1. Set a reasonable reflow soldering temperature curve and do real-time testing of the temperature curve regularly. 2. Weld according to the welding direction of PCB design. 3. Strictly prevent the conveyor belt from vibrating during the welding process. 4. The welding effect of a printed board m...Read more -
The principle of reflow oven
Reflow oven is the soldering of the mechanical and electrical connections between the terminations or pins of surface mount components and the printed board pads by remelting the paste-loaded solder pre-distributed on the printed board pads. Reflow soldering is to solder components to the PCB boa...Read more -
What is wave soldering machine?
Wave soldering means that the molten solder (lead-tin alloy) is sprayed into the solder wave crest required by the design through an electric pump or an electromagnetic pump. The board passes through the solder wave crest and forms a solder peak of a specific shape on the solder liquid level. The...Read more -
Selective Solder vs Wave Solder
Wave Solder The simplified process of using a wave solder machine: First, a layer of flux is sprayed to the underside of the target board. The purpose of the flux is to clean and prepare the components and PCB for soldering. To prevent thermal shock the board is slowly preheated before soldering...Read more -
Lead-free Reflow Profile: Soaking type vs. Slumping type
Lead-free Reflow Profile: Soaking type vs. Slumping type Reflow soldering is a process by which the solder paste is heated and changes to a molten state in order to connect components pins and PCB pads together permanently. There are four steps/zones to this process — preheating, soaking, r...Read more -
Under what conditions do you set different temperatures for the TOP and Bottom heating elements of a reflow oven?
Under what conditions do you set different temperatures for the TOP and Bottom heating elements of a reflow oven? In most situations, the thermal setpoints of a reflow oven are the same for both the Top and Bottom heating elements in the same zone. But there are special cases where it is necessar...Read more -
How to Maintain a Reflow Oven?
Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve production efficiency and product quality. One of the most important tasks for properly maintaining a reflow oven is remove the built-up flux residue inside the oven’s chamber. Althoug...Read more -
How to optimize the reflow profile?
How to optimize the reflow profile? According to the recommendation by the IPC association, the generic Pb-free solder reflow profile is shown below. The GREEN area is the acceptable range for the whole reflow process. Does it mean that every spot in this GREEN area should fit your board reflow a...Read more -
Reflow oven zone temperature set up and thermal profile
The process of hot air reflow soldering is essentially a heat transfer process. Before starting to “cook” the target board, the reflow oven zone temperature needs to be set up. Reflow oven zone temperature is a set point where the heat element will be heated to reach this temperature set point. T...Read more -
How the modern solder reflow oven works?
To successfully solder surface mount components to a circuit board, the heat should be transferred to the solder alloy paste until its temperature reaches a molten point (217°C for SAC305 lead free solder). The liquid alloy will merge with PCB copper pads and become a eutectic alloy mixture. A so...Read more -
SURFACE MOUNT PROCESS
Reflow soldering is the most widely used method of attaching surface mount components to printed circuit boards (PCBs). The aim of the process is to form acceptable solder joints by first pre-heating the components/PCB/solder paste and then melting the solder without causing damage by overheatin...Read more
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