The advantage of the SMT reflow oven process is that the temperature is easier to control, oxidation can be avoided during the soldering process, and the cost of manufacturing products is also easier to control. There is a set of electric heating circuits inside this device, which heats nitrogen to a high enough temperature and blows it to the circuit board where the components have been pasted, so that the solder on both sides of the components melts and bonds with the main board. TYtech will share some of the optimization method of SMT reflow soldering process here.
1. It is necessary to set up a scientific SMT reflow soldering temperature curve and conduct real-time testing of the temperature curve on a regular basis.
2. Solder according to the reflow soldering direction during PCB design.
3. During the SMT reflow soldering process, the conveyor belt should be prevented from vibrating.
4. The reflow soldering effect of the first printed board must be checked.
5. Whether the SMT reflow soldering is sufficient, whether the surface of the solder joint is smooth, whether the shape of the solder joint is half-moon, the condition of solder balls and residues, the condition of continuous soldering and virtual soldering. Also check for things like color changes on the PCB surface. And adjust the temperature curve according to the inspection results. During the whole batch production process, the welding quality should be checked regularly.
6. Regularly maintain the SMT reflow soldering. Due to the long-term operation of the machine, organic or inorganic pollutants such as solidified rosin are attached. In order to prevent secondary pollution of the PCB and ensure the smooth implementation of the process, regular maintenance and cleaning are required.
Post time: Jan-31-2023
