Reflow oven is the soldering of the mechanical and electrical connections between the terminations or pins of surface mount components and the printed board pads by remelting the paste-loaded solder pre-distributed on the printed board pads. Reflow soldering is to solder components to the PCB board, and reflow soldering is to mount devices on the surface. Reflow soldering relies on the action of hot air flow on solder joints, and the jelly-like flux undergoes physical reaction under a certain high temperature air flow to achieve SMD soldering; so it is called “reflow soldering” because the gas circulates in the welding machine to generate high temperature to achieve the purpose of soldering.
Post time: Jul-12-2022
