SMT Assembly Company o loʻo tuʻuina atu le BGA faʻapotopotoga, e aofia ai le BGA Rework ma le BGA Reballing auaunaga i totonu o le pisinisi lolomi a le Komiti Faʻatonu Fono talu mai le 2003. Faʻatasi ai ma meafaigaluega faʻapipiʻi BGA faʻaonaponei, faʻagasologa o faʻapotopotoga BGA maualuga, faʻataʻitaʻiga X- Ray Inspection meafaigaluega, ma sili customizable Complete PCB Fonotaga fofo, e mafai ona e faalagolago ia i matou e fausia tulaga maualuga ma fua maualuga laupapa BGA.
BGA Fonotaga Avanoa
SMT Assembly Company o loʻo i ai le SMT Assembly Company le poto masani i le taulimaina o ituaiga uma o BGA, e aofia ai le DSBGA ma isi Vaega Faʻalavelave, mai le micro BGAs (2mmX3mm) i le lapopoa BGAs (45 mm);mai BGA sima i BGA palasitika.e mafai ona latou tuu laʻititi 0.4 mm pitch BGAs i ySMT Fonotaga Kamupani PCB.
BGA Assembly Process/Fa'amatalaga vevela
O faʻamatalaga vevela e sili ona taua mo BGA i le PCB Assembly Process.O le a fa'atautaia e le SMT Assembly Company se su'esu'ega fa'aeteete DFM e toe iloilo uma faila PCB a le Kamupani Fono a le ySMT ma le fa'amaumauga a le BGA e atia'e ai se fa'amatalaga fa'alelei lelei mo le ySMT Assembly Company BGA fa'apotopotoga.SMT Assembly Company o le a ave le BGA lapopoa ma le BGA polo meafaitino (taʻitaʻia poʻo le Lead-Free) e faʻatatau i le faia o faʻamatalaga lelei vevela.
Pe a tele le tele faaletino BGA, SMT Fonotaga Kamupani o le a optimize le talaaga vevela e localize le vevela i luga o le BGA totonu e puipuia voids soofaatasi ma isi Faults Fono Aoao PCB masani.SMT Assembly Company mulimuli i le IPC Class II poʻo le Vasega III Quality Management taʻiala e faʻamautinoa ai soʻo se avanoa i lalo ole 25% o le aofaʻi atoa o le polo solder.BGAs e leai se ta'ita'i o le a alu i se fa'amatalaga fa'amama fa'apitoa e leai se ta'ita'i e aloese ai mai fa'afitauli o le polo matala e mafua mai i le vevela loSMT Assembly Companyr;i le isi itu, o le a alu BGA taʻitaʻia i se faiga faʻapitoa e taʻitaʻia e puipuia ai le maualuga o le vevela mai le mafuaʻaga o pine pupuu.Ina ua maua le Kamupani Fono a le SMT ySMT Assembly Company Turn-Key PCB Assembly order, o le SMT Assembly Company o le a siaki le ySMT Assembly Company PCB design e toe iloilo soʻo se iloiloga faʻapitoa i vaega BGA i le taimi o le SMT Assembly Company meticulous DFM (Design for Manufacturability).
O le fa'amaoniga atoa e aofia ai siaki mo le PCB Laminate Material compatibility, Surface Finish effects, le maualuga o le taua ma le Solder Mask clearance.O nei mea uma e aʻafia ai le lelei o le BGA faʻapotopotoga.
BGA soli, BGA Rework & Reballing
Atonu e na'o ni nai BGA po'o ni vaega lelei o le pitch i luga ole ySMT Assembly Company PC laupapa e mana'omia PCB fa'apotopotoga mo le R&D prototyping.SMT Assembly Company e mafai ona fesoasoani - SMT Assembly Company e tuʻuina atu se auaunaga faʻapipiʻi BGA faʻapitoa mo suʻega ma iloiloga faʻamoemoe o se vaega o le SMT Assembly Company e taulaʻi ile Prototype PCB Assembly.
E le gata i lea, e mafai e le Kamupani a le SMT Assembly ona fesoasoani ia te oe i le BGA rework ma le BGA reballing i se tau taugofie!SMT Assembly Company e mulimulitaia laasaga autu e lima e faatino ai le BGA rework: aveese vaega, tapenaga o nofoaga, faʻapipiʻi faʻapipiʻi faʻapipiʻi, sui BGA, ma le Toe Faʻaulu.SMT Assembly Company fa'amautinoa e 100% o laupapa a le ySMT Assembly Company o le a fa'atinoina atoatoa pe a toe fa'afo'i atu ia te oe.
BGA Assembly X-Ray Asiasiga
SMT Assembly Company e fa'aogaina se masini X-Ray e su'esu'e ai fa'aletonu eseese e ono tupu i le taimi o le fa'apotopotoga BGA.
E ala i suʻesuʻega X-ray, e mafai e le Kamupani Faʻapotopotoga a le SMT ona faʻaumatia faʻafitauli faʻapipiʻi i luga o le laupapa, e pei ole Solder Balls ma Paste Bridging.E le gata i lea, e mafai e le SMT Assembly Company X-Ray lagolago polokalama ona fuafua le tele o le va i le polo ina ia mautinoa e mulimulitai i tulaga IPC Vasega II poʻo Vasega III, e tusa ai ma manaʻoga a le ySMT Assembly Company.SMT Assembly Company e mafai foʻi ona faʻaogaina 2D X-ray e tuʻuina atu ata 3D ina ia siaki ai faʻafitauli e pei o PCB gau, e aofia ai Via i Pad BGA Designs ma Blind / Buried Vias mo papa i totonu, e pei o le SMT Assembly Companyll e pei o solder malulu i polo BGA.