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SMT Solder bar and wire

Short Description:

Product model list:

Category Model Alloy (%) Melting temperature (°C) Minimum wire diameter (mm) Lead-free alloy series
TYtech-601A Sn96.5/Ag3.0/Cu0.5 217-219 0.14 (including rosin)
TYtech-601C Sn985/Agl.0/Cu0.5 227-229 0.11 (including rosin)
TYtech-608A Sn99/Ag03/Cu0.7 227-229 0.11 (including rosin)
TYtech 608B Sn98.8/Ag0.5/Cu0.7 227-229 0.11 (including rosin)
TYtech-601E Sn96.5/Ag3.S 217-219 0.11 (including rosin)
TYtech-601D Sn97/Ag3.0 227-229 0.11 (including rosin)
TYtech-608C Sn99.5/Ag0.5 227-229 0.11 (including rosin)
TYtech-601B Sn99.7/Ag03 227-229 0.11 (including rosin)
TYtech-603C Sn99.3/Cu0.7 227 0.11 (including rosin)
TYtech-609A Sn42/Bi58 138TBD
TYtech-609E Sn90/$bl0 250 0.11 (including spacer)
Lead alloy series
TYtech-60/40 Sn60/Pb40 183 . 0.3 (including rosin)
TYtech-63/37 Sn63/Pb37 183 0.3 (including rosin)
TYtech-10/90 Snl0/Pb90 302 0.3 (including rosin)


Product Detail

Product Tags

Product features and advantages:

Fast wetting: Shorten cycle times for manual encapsulation and component repair operations.
Minimal Flux Spatter: Safe and easy to use with minimal board residue.
Good diffusion characteristics: excellent solder joints, first pass rate, expansion ability ≥ 80% (according to JIS standard).
Low Smoke Levels: Clean work environment and reduced smoke handling.
Clear, non-sticky residue: no-clean residue for all operations.
Good weld appearance: easier visual inspection
Halogen-free and halide-free: meet environmental requirements and high electrical reliability.


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