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Lead-isina Reflow Profile: Soaking type vs. Slumping type

Lead-isina Reflow Profile: Soaking type vs. Slumping type

Reflow soldering inzira iyo solder paste inodziiswa uye inochinja kuita yakanyungudutswa kuitira kubatanidza mapini mapini uye PCB pads pamwechete zvachose.

Kune nhanho ina/nzvimbo dzekuita uku - preheating, soaking, reflow uye kutonhora.

Kune yechinyakare trapezoidal mhando mbiri base pane lead yemahara solder paste iyo Bittele inoshandisa kune SMT musangano maitiro:

  1. Preheating zone: Preheat kazhinji inoreva kuwedzera tembiricha kubva kune yakajairika tembiricha kusvika 150 ° C uye kubva 150 °C kusvika 180 C. Tembiricha ramp kubva zvakajairika kusvika 150 ° C isingasviki 5 ° C / sec (pa1.5 ° C ~ 3 ° C / sec), uye nguva iri pakati pe150 ° C kusvika 180 ° C inotenderera 60 ~ 220 sec.Kubatsira kweinononoka kudziya ndeyekusiya solvent uye mvura muhuputi hwepaste ichibuda nenguva.Iyo zvakare inoregedza zvinhu zvakakura zvichipisa zvakangofanana nezvimwe zvikamu zvidiki.
  2. Soaking zone: Iyo preheating nguva kubva 150 ° C kusvika kune alloy yakanyungudutswa point inozivikanwawo senguva yekunyura, zvinoreva kuti flux iri kushanda uye iri kubvisa oxidized chinotsiva pamusoro pesimbi saka yakagadzirira kugadzira yakanaka solder joint. pakati pezvikamu mapini uye PCB pads.
  3. Reflow zone: Iyo reflow zone, inonziwo "nguva iri pamusoro pe liquidus" (TAL), ndiyo chikamu chemaitiro apo tembiricha yepamusoro inosvika.Tembiricha yakajairika i20-40 °C pamusoro pemvura.
  4. Kutonhodza nzvimbo: Munzvimbo yekutonhodza, tembiricha iri kudzikira zvishoma nezvishoma uye inogadzira majoini akasimba ekutengesa.Iyo yakanyanya kutenderwa kutonhora pasi pamateru inoda kutariswa kuitira kudzivirira chero chakakanganisika kubva kuitika.Kutonhodza kwe4°C/s kunokurudzirwa.

Kune maviri akasiyana maprofile anosanganisirwa mune reflow process - soaking type uye slumping type.

Rudzi rweKunyura rwakafanana nechimiro chetrapezoidal nepo rudzi rwekudonha rune delta shape.Kana bhodhi iri nyore uye pasina zvinhu zvakaoma zvakadai seBGA kana zvikamu zvakakura pabhodhi, iyo slumping type profile ichava sarudzo iri nani.

reflow soldering

 


Nguva yekutumira: Jul-07-2022