Muuqaal
Codsiga Alaabta
1. Alxanka iyo alxanka dhammaan Chip-ga BGA, ka saar oo hagaajiso Motherboard-yada kala duwan ee BGA IC chip iyo qaybaha kale (Lead free & lead la heli karo).
2. Waxay hoos u dhigi kartaa kharashka wax-soo-saarka dib-u-shaqaynta IC Chip-ka xun ee alxanka inta lagu jiro nidaamka isku-xidhka PCB.
3. Nidaamka toosinta indhaha, waxaad si fudud dib ugu shaqayn kartaa BGA-ga, oo ilaali indhahaaga daciifka ah.
4. Waxay dib u shaqayn kartaa BGA, LED, IC iyo chipsets-yada kale ee yar yar si sax ah.Gaar ahaanku habboon dib-u-shaqaynta motherboard-ka saxda ah, waxaa loogu talagalay dib-u-shaqeyn sax ah.
5. Si weyn loogu isticmaalo BGA dib-u-habaynta Chipset-ka dib-u-habaynta laptop-ka, PS3,PS4,XBOX360,Mobiletelefoonka, iwm.
6. Dib u shaqaysii micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, iwm
Tilmaamaha ugu muhiimsan
Aag weyn oo fiber carbon infrared ah Nidaamka kuleylinta ka hor, oo leh faa'iidada kuleylinta ka hor si degdeg ah oo siman oo aan lahayn wasakh khafiif ah.
Qiyaasaha heerkulka waxaa lagu ilaaliyaa xadka awoodda, si looga fogaado dejinta khaladaadka.
Toban qaybood oo habka xakamaynta heerkulka, ku haboon dhammaan noocyada BGA Rework.
Kaydinta aan xadidnayn ee astaanta heerkulka, kaliya u baahan hal fure si aad u isticmaasho astaanta guud.
Saddexda dareemayaasha nooca-K ee la heli karo waxay ogaan karaan tijaabada heerkulka saxda ah ee saxda ah ee dhibic kasta oo PCB ama BGA ah, PC-ga ayaa si toos ah u soo saari kara warbixinta falanqaynta qaloocayada.
Burburinta iyo iibinta si toos ah, Looma baahna hagaajinta gacanta
Socodka hawada kulul waa la hagaajin karaa si loo daboolo baahida chips kasta
USB Connection-free darawalka, kontoroolka PC
Xakamaynta sare ee hawada kulul ee hoose ee laga heli karo qaybta hore, way ku habboon tahay in la hagaajiyo wakhti kasta.
Meelaynta laser-ka ayaa diyaar ah, si meelaynta looga dhigo mid dhakhso badan.
Tilmaamaha soo bandhigay
●3 kuleyliyaha kontoroolka madax banaan
① TKuleyliyeyaasha op iyo kuwa hoose waa kuleyliyaha hawo kuleyl, IR saddexaadkuleyliyahawaa kuleyliyaha infrared, kuleyliyeyaasha sare iyo kuwa hoose waxay PCB ka kululayn karaan xagga sare iyo btoomatahisku mar.saxnaanta heerkulka gudaha ±3℃,waxaa jirabadanqaybaha waxaa lagu dejin karaa atahisku mar;Aagga kululaynta IR waa la hagaajin karaa si waafaqsanto Codsiyada rabitaanka, si loo sameeyo kuleylka PCB xitaaly.
②It kululayn kartaa PCBlooxa iyo bga chips isku mar.Iyo kuleyliyaha saddexaad ee IR ayaa karahoray uga sii kululee looxa PCB hoosta, si aad uga fogaato PCB in ay waxyeeleyso inta lagu jiro habka dayactirka.TheKuleyliyeyaasha sare iyo kuwa hoose ayaa si madaxbannaan u kululeeya;
③Choose sare accurateK ku qor heerkulbeegyada dhow-loop, iyo cabirrada PID si toos ahanidaamka toosinta;way muujin kartaatoddobo heerkul wareeg ah iyo milyans ee gduufsansxogta waa la keydin karaaiyada oo loo marayoQalabka kaydintae,lehfalanqeynta qalooca degdega ahiyofalanqaynta heerkulka BGA wakhti kasta;Dareemaha ayaa loogu talagalay baaritaanka heerkulka saxda ah.
●Nidaamka toosinta indhaha ee saxda ah
Adopt nidaamka midabka CCD ee la hagaajin karo, oo leh kala qaybsanaan beam, soo jiidan, soo bixi iyo hawlo yar- hagaajin, ayaa si toos ah u lehchromatismxallinta iyodhalaalayanacasnimohagaajintanidaamka,xoojinilaa 230 X, kor u qaadista saxnaanta gudaha±0.02mm.
●Nidaamka hawlgalka ee hawlaha badan
①Qabo qeexitaan sare ee mashiinka-mashiinka, diyaar u ah dejinta"dhigay”iyo"hawlgeli”si looga fogaado goobaha khaladka ah, Qalabka kuleyliyaha sare iyo madaxa ku dhejinta 2 in 1 design, oo leh si toos ah u aqoonso chips BGA iyo dhererka dhajinta, waxay ka mid tahay alxanka tooska ah iyo shaqada wax-soo-saarka. waxay dejin kartaa 6 qaybood oo kor u kaca heerkulka iyo 6 qaybood heerkulka dhaqdhaqaaqa kaydi N kooxaha profiles heerkulka.La qaatay dhammaan noocyada nozzles BGA, oo leh 360° wareeg, fududahay in la rakibo iyo beddelka, habaysan waa la heli karaa;
②Taageerada V-groove PCB, oo leh meelayn degdeg ah, ku habboon oo sax ah, waxay ku habboonaan kartaa dhammaan noocyada guddiga PCB;Qalab caalami ah oo dabacsan oo la saari karo ayaa leh saameyn difaac oo aan waxyeello u geysan guddiga PCB, oo ku habboon dhammaan noocyada cabbirrada ee dayactirka BGA.
●Hawlaha badbaadada sare
Iyadoo shahaadada CE;Ka dib markii la burburiyo oo la iibiyo, waxaa jira qaylo-dhaan.marka heerkulku faraha ka baxo;wareeggu wuxuu si toos ah u dami doonaa, waa shaqo ilaalin heerkul ka badan oo labanlaab ah.Heerkulka heerkulku wuxuu leeyahay erayga sirta ah ee laga fogaadoisbedel aan sabab lahayn, oo leh hawlaha ilaalinta badbaadada ee sarreeya, ayaa ilaalin karaQaybaha guddiga PCB iyo mishiinka ka soo gaaray burburka xaalad kasta oo aan caadi ahayn.
Sawirka Faahfaahin
Madaxa kor u kaca BGA
CCD muraayad isku toosan indhaha
Taabo xakamaynta shaashadda
Nidaamka toosinta indhaha
booska Laser
xakamaynta Joystick
Tilmaamaha
Qaabka | TY-7220A |
Awood | AC 220V± 10 50/60 Hz |
Wadarta Awoodda | ugu badnaan 5100W |
Awoodda kulayliyaha | Kuleyliyaha sare 1000 W Kuleyliyaha hoose 1200 W IR kuleyliyaha 2700 W |
Qalabka korantada | Intelligence Programmable controller, taageero ku xidhid computer |
Xakamaynta heerkulka | Heerkulbeegyada nooca K (Lop Loop), xakamaynta heerkulka madaxbannaanida, saxnaanta gudaha ± 1 ℃ |
Meelaynta | V-groove, taageerada PCB |
Cabbirka PCB | Ugu badnaan 415*370 mm Min 6*6 mm |
Chip BGA | Ugu badnaan 60*60 mm Min 2*2 mm |
Cabirka | L685*W635*H960 mm |
Dareemayaasha | 1 pc |
Miisaanka | 76kg |