Khamphani ea Kopano ea SMT esale e fana ka kopano ea BGA, ho kenyeletsoa BGA Rework le BGA Reballing services indastering ea Kopano ea Boto ea Potoloho e Hatisitsoeng ho tloha 2003. Ka lisebelisoa tsa boemo bo holimo tsa ho beoa tsa BGA, lits'ebetso tsa kopano ea BGA tse nepahetseng haholo, X- Thepa ea Ray Inspection, le litharollo tsa Complete PCB Assembly tse u ka khonang haholo, u ka itšetleha ka rona ho haha liboto tsa BGA tsa boleng bo holimo le tse hlahisang lihlahisoa tse phahameng.
BGA Bokhoni ba Kopano
SMT Assembly Company e na le SMT Assembly Companyalth ea phihlelo ea ho sebetsana le mefuta eohle ea BGA, ho kenyeletsoa DSBGA le likarolo tse ling tsa Complex Complex, ho tloha ho li-BGA tse nyenyane (2mmX3mm) ho ea ho li-BGA tse kholo (45 mm);ho tloha ho li-BGA tsa ceramic ho ea ho li-BGA tsa polasetiki.ba khona ho beha bonyane limilimithara tse 0.4 tsa BGA ho ySMT Assembly Company PCB.
Mokhoa oa Kopano oa BGA / Li-profiles tsa Thermal
Boemo ba mocheso ke ba bohlokoa haholo bakeng sa BGA ho Ts'ebetso ea Kopano ea PCB.Sehlopha sa tlhahiso ea SMT Assembly Company se tla etsa Tlhahlobo ea DFM e hlokolosi ho hlahloba lifaele tsa ySMT Assembly Company PCB ka bobeli le database ea BGA ho etsa profaele e ntlafalitsoeng ea mocheso bakeng sa ts'ebetso ea kopano ea ySMT Assembly Company BGA.Khamphani ea Kopano ea SMT e tla nka boholo ba BGA le sebopeho sa thepa ea bolo ea BGA (e etelletsoeng pele kapa e sa Lebelloang) ho nahanela ho etsa liprofaele tse sebetsang hantle tsa mocheso.
Ha boholo ba 'mele ba BGA bo le boholo, Khamphani ea Kopano ea SMT e tla ntlafatsa boemo ba mocheso ho etsa hore mocheso o be teng ka hare ho BGA ho thibela li-voids tse kopanetsoeng le Liphoso tse ling tse Tloaelehileng tsa Kopano ea PCB.SMT Assembly Company e latela IPC Class II kapa Class III Quality Management guidelines ho etsa bonnete ba hore likheo leha e le life li ka tlase ho 25% ea bophara ba bolo ea solder.Li-BGA tse se nang lead li tla feta sebakeng se ikhethileng sa mocheso o se nang lead ho qoba mathata a bolo a bulehileng a ka bakoang ke mocheso oa loSMT Assembly Companyr;ka lehlakoreng le leng, li-BGA tse etelletsoeng pele li tla feta ts'ebetsong e khethehileng e etelletsoeng pele ho thibela mocheso o phahameng hore o se ke oa baka li-shorts tsa pin.Ha SMT Assembly Company e amohela taelo ea Kopano ea Khamphani ea ySMT Turn-Key PCB, SMT Assembly Company e tla hlahloba moralo oa ySMT Assembly Company PCB ho lekola lintlha life kapa life tse amanang le likarolo tsa BGA nakong ea tlhahlobo e hlokolosi ea Khamphani ea SMT (Design for Manufacturability).
Netefatso e felletseng e kenyelletsa licheke bakeng sa tšebelisano ea PCB Laminate Material, litlamorao tsa Surface Finish, tlhokahalo e phahameng ea leqephe la ntoa le tumello ea Solder Mask.Lintlha tsena kaofela li ama boleng ba kopano ea BGA.
BGA soldering, BGA Rework & Reballing
O kanna oa ba le li-BGA tse 'maloa feela kapa likarolo tse ntle ho liboto tsa PC tsa ySMT Assembly Company tse hlokang kopano ea PCB bakeng sa prototyping ea R&D.Khamphani ea Kopano ea SMT e ka thusa - Khamphani ea Kopano ea SMT e fana ka ts'ebeletso e khethehileng ea thekiso ea BGA bakeng sa liteko le tlhahlobo e le karolo ea SMT Assembly Company e shebaneng le Prototype PCB Assembly.
Ho feta moo, Khamphani ea Kopano ea SMT e ka u thusa ka BGA rework le BGA reballing ka theko e tlase!Khamphani ea Kopano ea SMT e latela mehato e mehlano ea mantlha ea ho etsa rework ea BGA: ho tlosa likarolo, ho lokisoa ha sebaka, kopo ea solder paste, phetoho ea BGA, le Reflow Soldering.SMT Assembly Company e tiisa hore 100% ea liboto tsa ySMT Assembly Company li tla sebetsa ka botlalo ha li khutlisetsoa ho uena.
BGA Kopano X-Ray Tlhahlobo
SMT Assembly Company e sebelisa mochini oa X-Ray ho bona mefokolo e fapaneng e ka hlahang nakong ea kopano ea BGA.
Ka tlhahlobo ea X-ray, Khamphani ea Kopano ea SMT e ka felisa mathata a ho soahla ka boto, joalo ka Solder Balls le Paste Bridging.Hape, software ea tšehetso ea SMT Assembly Company X-Ray e ka bala boholo ba lekhalo la bolo ho etsa bonnete ba hore e latela litekanyetso tsa IPC tsa Sehlopha sa II kapa tsa Sehlopha sa III, ho latela litlhoko tsa Khamphani ea Kopano ea ySMT.SMT Assembly Company e nang le litheknishiene tse nang le phihlelo e ka boela ea sebelisa X-rays ea 2D ho fana ka litšoantšo tsa 3D ho hlahloba mathata a kang PCB e robehileng, ho akarelletsa le Via in Pad BGA Designs le Blind / Buried Vias bakeng sa likarolo tse ka hare, joalo ka SMT Assembly Companyll e le manonyeletso a batang. ka libolo tsa BGA.