BGA rework station le optical alignment TY-7220A

Sesebelisoa sa Sehlahisoa

1. Desolder le solder kaofela BGA Chip, tlosa le ho lokisa motherboard fapaneng BGA IC chip le likarolo tse ling (Lead free & lead fumaneha).

2. E ka fokotsa litšenyehelo tsa tlhahiso ho tsoa ho ts'ebetso e mpe ea solder IC Chip nakong ea ts'ebetso ea kopano ea PCB.

3. Ka tsamaiso ea Optical alignment, u ka boela ua sebetsa BGA hantle habonolo, le ho sireletsa mahlo a hao a fokolang.

4. E ka sebetsa hape BGA, LED, IC le li-chipsets tse ling tse nyane ka nepo e phahameng.Haholo-holosutu bakeng sa rework e phahameng ea boardboard, e etselitsoe ho sebetsa hape ka nepo.

5. Ho pharaletseng sebelisoa bakeng sa BGA reballing chipset lokisa ka laptop ea, PS3,PS4,XBOX360,Mobilemohala, joalo-joalo.

6. Rework micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, joalo-joalo.

Lintlha tse ka sehloohong

Sebaka se seholo sa infrared carbon fiber Pre-heating system, e nang le molemo oa ho futhumatsa pele ka potlako le ka mokhoa o lekanang le ho se na tšilafalo e khanyang.

Mekhahlelo ea mocheso e sirelelitsoeng ke meeli ea bolaoli, bakeng sa ho qoba litlhophiso tsa liphoso.

Likarolo tse leshome tsa ts'ebetso ea taolo ea mocheso, tse loketseng mefuta eohle ea BGA Rework.

Polokelo e se nang moeli ea profil ea mocheso, o hloka feela ho tobetsa konopo e le 'ngoe ho sebelisa profil.

Li-sensor tse tharo tse fumanehang tsa mofuta oa K li ka lemoha tlhahlobo e nepahetseng ea mocheso oa ntlha ka 'ngoe ea PCB kapa BGA, mme PC e ka hlahisa tlaleho ea tlhahlobo ea li-curve ka bo eona.

Desoldering le soldering ka tsela e iketsang, Ha ho hlokahale tokiso pukwanana

Phallo ea moea o chesang e ka feto-fetoha ho fihlela tlhoko ea li-chips life kapa life

USB Connection ha e na mokhanni, taolo ea PC

Taolo ea ho phahamisa moea o chesang e tlase e fumanehang ka pele ho phanele, ho bonolo ho e fetola ka nako efe kapa efe.

Laser positioning e fumaneha, ho etsa hore boemo bo be kapele.

Ho hlahisa likarolo

●Liheaters tse 3 tse ikemetseng tsa taolo

① Tlihitara tsa op le tse tlase ke tse futhumatsang moea o chesang, IR ea boraroheaterke mocheso oa infrared, liheaters tse holimo le tse tlase li ka futhumatsa PCB ho tloha holimo le bottomhothenako yona eo.ho nepahala ha mocheso ka hare ho ±3℃,ho na lebongatalikarolo li ka behoa hotheka nako e tšoanang;Sebaka sa ho futhumatsa sa IR se fetoha ho latelato takatso likopo, ho etsa PCB futhumatsang esita lely.

②It e ka futhumatsa PCBboto le li-bga chips ka nako e le 'ngoe.'Me heater ea boraro ea IR e ka khonapreheat boto ea PCB ho tloha tlase, ho qoba PCB ho tloha deformation nakong ea ho lokisa.Theli-heaters tse ka holimo le ka tlase li futhumatsa ka boikemelo;

③Chose high accurateK mofuta oa close-loop thermocouple, le li-parameter tsa PID ka mokhoa o iketsangatsamaiso ea phetoho;e ka bontshalikhahla tse supileng tsa mocheso le miliones ea gropasdata e ka bolokoakaSesebediswa sa polokeloe,kamosebetsi oa ho hlahloba li-curves hang hangleho sekaseka mocheso oa BGA ka nako efe kapa efe;sensor ke bakeng sa tlhahlobo e nepahetseng ea mocheso.

●Sistimi e nepahetseng ea ho hokahanya ha optical

ASistimi ea optical color e fetolehang ea dopt ea CCD, e nang le ho arohana ha maballo, ho atametsa, ho atametsa le ho fetola mesebetsi e nyane, e na le othomathiki.chromatismqeto lee kganyangnesstokisotsamaiso,hōlisaho 230 X, ho nepahala ho ntseng ho eketseha ka hare±0.02mm.

●Sistimi ea ts'ebetso ea mesebetsi e mengata

①Adopt interface e phahameng ea mochini oa motho, e fumanehang bakeng sa ho hlophisoa“tlhophiso”le“sebetsa”ho qoba litlhophiso tsa liphoso, The top heater device and mounting head 2 in 1 design, with automatic detecting BGA chips and mounting height, it is of automatic soldering and desoldering function.e ka beha likarolo tse 6 mocheso o ntseng o phahama le mocheso oa likarolo tse 6, 'me o ka khona. boloka lifaele tsa mocheso oa lihlopha tsa N.E amohetse mefuta eohle ea li-nozzles tsa BGA, tse nang le 360° ho potoloha, ho bonolo bakeng sa ho kenya le ho nkeloa sebaka, ho etsoa ka mokhoa o ikhethileng;

②Ts'ehetso ea PCB ea V-groove, e nang le boemo bo potlakileng, bo loketseng le bo nepahetseng, e ka lekana mefuta eohle ea boto ea PCB;Flexible le removable bokahohleng fixture na le liphello tse sireletsang 'me ha ho na tšenyo ho PCB boto, a loketse bakeng sa mefuta eohle ea boholo ba BGA tokiso.

●Mesebetsi e phahameng ea tšireletso

Ka setifikeiti sa CE;ka mor'a desoldering le soldering, ho na le tšosa.ha mocheso o tsoa taolong;potoloho e tla tima ka tsela e iketsang, ke ea habeli ho feta-mocheso tshireletso tshebetso.Sebaka sa mocheso se na le phasewete eo u lokelang ho e qobaliphetoho tse sa lebelloang, ka mesebetsi e phahameng ea tšireletso ea tšireletso, e ka sireletsaLikarolo tsa boto ea PCB le mochini o tsoang ho senya ho boemo bofe kapa bofe bo sa tloaelehang.