Mochini oa Tlhahlobo oa Mirtec 3D Inline SPI MS-11

MS-11 letoto ke inline 3D SPI mochini o hlahlobang boemo ba palo ea solder ka mor'a hore solder e hasane ho utloisisa ka ho hlaka tshebetso.Ka kh'amera ea 25 Megapixel e kenyang letsoho ntlafatsong ea tlhahiso, tlhahlobo ea solder ea boholo ba 0201(mm) e ka khonahala.

Dual Projection Probe
Ho fokotsa phoso e bakiloeng ke meriti ebe o nka likarolo tse phahameng ka projeke e le 'ngoe, ho sebelisoa probe ea projeke e habeli.Ka tekanyo e nepahetseng le e nepahetseng ea 3D ha u nahana ka likarolo tse phahameng tse sothehileng litekanyo ka lebaka la liphello tsa moriti li felisoa ka ho feletseng.

• Maikutlo a mabeli a ho rarolla bothata ka botlalo ba moriti oa refelection
• Motsoako oa litšoantšo tse tsoang lehlakoreng le fapaneng bakeng sa tekanyo e felletseng ea molumo
• Bokhoni bo phethahetseng le bo nepahetseng ba ho lekanya 3D

Khamera ea Pele Lefatšeng ea Qeto e Phahameng ea 25 Megapixel
Re motlotlo hore ebe re sebelisitse tsamaiso ea pono ea moloko o latelang e nang le kh'amera e phahameng ea 25 Megapixel bakeng sa tlhahlobo e nepahetseng le e tsitsitseng le mokhoa o le mong feela oa lefats'e oa phetisetso ea lebelo le phahameng oa CoaXPress ho lumella phetisetso ea matsatsi a 4 ho feta le 40% ho eketsa lebelo la ts'ebetso.

• Khamera ea lefatše ea 25 Megapixel e kentsoe
• Sistimi ea pono e phahameng ea CoaXPress e sebelisitsoe
• FOV e kholo ho eketsa lebelo la tlhahlobo
• Lebelo la ho sebetsa le eketsehile ka 40% ha le bapisoa le Sehokelo sa Khamera

Sistimi ea ho Hlahloba e se nang Warpage
Mochini oa SPI o lemoha sebaka sa ntoa sa PCB ka har'a FOV ha se ntse se hapa setšoantšo sa boto, 'me se se buseletsa ka bohona, e le hore li-PCB tse kobehileng li ka hlahlojoa ntle le bothata.

• Tlhahlobo ea Bent PCB ntle le motsamao oa Z-Axis
• Bokhoni ba ho hlahloba ho tloha ± 2mm ho isa ± 5mm (ho ipapisitse le Lense)
• Liphetho tse nepahetseng haholoanyane tsa 3D li netefalitsoe.