Uphawu
Isicelo seMveliso
1. I-Desolder kunye ne-solder yonke i-Chip ye-BGA, susa kwaye ulungise i-motherboard eyahlukeneyo ye-BGA IC chip kunye namanye amacandelo (Lead free & lead available).
2. Inokucutha iindleko zemveliso ekusebenzeni ngokutsha i-IC Chip embi ye-soldering ngexesha lenkqubo yendibano ye-PCB.
3. Ngenkqubo yolungelelwaniso lwe-Optical, unokuphinda usebenze i-BGA ngokulula, kwaye uwakhusele amehlo akho abuthathaka.
4. Iyakwazi ukuphinda isebenze i-BGA, i-LED, i-IC kunye nezinye i-chipsets ezincinci ngokuchaneka okuphezulu.Ingakumbiisuti yokuchaneka okuphezulu kokusebenza kwakhona kwebhodi yomama, yenzelwe ukulungiswa kwakhona okuchanekileyo.
5. Isetyenziselwa ngokubanzi ukulungiswa kwe-chipset ye-BGA kwi-laptop, PS3, PS4, XBOX360,Iselulaifowuni, njl.
6. Rework micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, njl.
Iimpawu eziphambili
Indawo enkulu ye-infrared carbon fiber Pre-heating system, kunye nenzuzo yokufudumeza kwangaphambili ngokukhawuleza kwaye ngokulinganayo kwaye akukho ngcoliseko yokukhanya.
Iiparamitha zobushushu ezikhuselwe yimida yegunya, ukuthintela useto lwempazamo.
Amacandelo alishumi inkqubo yokulawula ubushushu, ilungele zonke iintlobo BGA Rework.
Ukugcinwa okungenamkhawulo kweprofayile yobushushu, kufuneka ucinezele iqhosha elinye ukuze usebenzise iprofayile.
Abenzi boluvo abathathu bohlobo lwe-K abakhoyo banokuqonda uvavanyo lobushushu oluchanekileyo kwindawo nganye yePCB okanye iBGA, kwaye iPC inokuvelisa ingxelo yohlalutyo lweegophe ngokuzenzekelayo.
I-Desoldering kunye ne-soldering ngokuzenzekelayo, Akukho mfuneko yokulungelelanisa ngesandla
Ukuhamba komoya oshushu kunokulungiswa ukuhlangabezana nemfuno yazo naziphi na iitshiphusi
USB Connection umqhubi-free, ulawulo PC
Ulawulo olusezantsi lokuphakamisa umoya oshushu olukhoyo kwipaneli yangaphambili, kukulungele ukulungelelanisa nanini na.
Ukubekwa kweLaser kufumaneka, ukwenza indawo ngokukhawuleza.
Iimpawu zazisa
●Izifudumezi ezizimeleyo ezi-3
① TIzifudumezi ze-op kunye nezisezantsi zizifudumezi zomoya oshushu, i-IR yesithathuisifudumeziUkufudumeza kwe-infrared, izifudumezi eziphezulu nezisezantsi zinokufudumeza iPCB ukusuka phezulu kunye ne-bottomeixeshanye.ukuchaneka kobushushu ngaphakathi ±3℃,naziezininziizahlulo zinokumiselwaixeshanye;Indawo yokufudumala ye-IR ilungelelaniswa ngokuhambelanato izicelo umnqweno, ukwenza PCB ukufudumeza nkquly.
②It inokutshisa iPCBibhodi kunye chips bga ngaxeshanye.Kwaye wesithathu IR can heaterpreheat ibhodi PCB ukusuka ezantsi, ukuphepha PCB ukusuka deformation ngexesha inkqubo yokulungisa.IIzifudumezi eziphezulu kunye nezantsi zifudumala ngokuzimeleyo;
③Ci-hoose high accurateK chwetheza close-loop thermocouple, kunye PID parameters automaticainkqubo yohlengahlengiso;ingabonisaamagophe asixhenxe obushushu kunye nesigidis ye giqelasidatha ingagcinwangeU isixhobo sokugcinae,kunyeumsebenzi wokuhlalutya iigophe ngoko nangokokwayeukuhlalutya ubushushu be-BGA nangaliphi na ixesha;inzwa yovavanyo lobushushu obuchanekileyo.
●Inkqubo yolungelelwaniso lwamehlo echanekileyo
AIdopt, inkqubo ye-CCD ehlengahlengiswayo yombala, enomqadi wokwahlula, yandisa, yandisa ngaphandle kunye nemisebenzi yokulungelelanisa, izenzekelayochromatismisisombululo kunyeeqaqambileyonessuhlengahlengisoinkqubo,khulisaukuya ku-230 X, ukunyusa ukuchaneka ngaphakathi±0.02mm.
●Inkqubo yokusebenza yemisebenzi emininzi
①Yamkela inkcazo ephezulu yojongano lomatshini wobuntu, ekhoyo ngokusetwa“Misela”kwaye“sebenza”ukunqanda useto lwempazamo, Isixhobo sokufudumeza okuphezulu kunye nentloko enyukayo ye-2 kuyilo lwe-1, kunye nokuchonga ngokuzenzekelayo iitshiphusi ze-BGA kunye nokuphakama okunyukayo, yinto yokuthengisela ngokuzenzekelayo kunye ne-desoldering function.it inokuseta amacandelo angama-6 ukunyuka kweqondo lobushushu kunye namacandelo angama-6 obushushu bomsebenzi, kwaye inako. gcina iiprofayili zobushushu zamaqela e-N.Yamkelwa zonke iintlobo zemilomo ye-BGA, ene-360° ukujikeleza, kulula ukufakela kunye nokutshintshwa, ukulungelelaniswa kuyafumaneka;
②Inkxaso ye-PCB ye-V-groove, enendawo ekhawulezayo, efanelekileyo nechanekileyo, inokulungela zonke iintlobo zebhodi yePCB;I-Flexible kunye nokususwa kwe-universal fixture ineempembelelo zokukhusela kwaye akukho monakalo kwibhodi ye-PCB, ilungele zonke iintlobo zobukhulu be-BGA yokulungisa.
●Imisebenzi yokhuseleko ephezulu
Ngesatifikethi seCE;emva kwe-desolder kunye ne-soldering, kukho ukothusa.xa ubushushu buphuma kulawulo;isekethe iya kucima ngokuzenzekelayo, inomsebenzi wokukhusela ubushushu obuphindwe kabini.Iparamitha yobushushu inegama lokugqitha ekufuneka uyiphepheutshintsho olungenasizathu, kunye nemisebenzi ephezulu yokukhusela ukhuseleko, inokukhuselaamacandelo PCB ibhodi kunye nomatshini ukusuka umonakalo kwi nayiphi na imeko engaqhelekanga.
Umfanekiso weenkcukacha
BGA intloko enyukayo
Ilensi yokulungelelanisa yeCCD
Ulawulo lwesikrini sokuchukumisa
Inkqubo yokulungelelaniswa kwamehlo
Indawo yeLaser
Ulawulo lwe-Joystick
Iinkcukacha
Umzekelo | I-TY-7220A |
Amandla | AC 220V±10% 50/60 Hz |
Amandla Aphelele | Ubukhulu be-5100W |
Amandla okufudumala | Isifudumezisi esiphezulu 1000 W Isifudumezisi esisezantsi 1200 W IR heater 2700 W |
Izinto zombane | Intelligence Programmable isilawuli, inkxaso ukudibanisa computer |
Ulawulo lobushushu | K-uhlobo lwe-thermocouple (I-Loop evaliweyo), ulawulo lobushushu obuzimeleyo, ukuchaneka ngaphakathi kwe±1℃ |
Ukuma | V-groove, inkxaso PCB |
Ubungakanani bePCB | Ubukhulu 415*370 mm Min 6*6 mm |
Itshiphu ye-BGA | Ubukhulu 60*60 mm Min 2*2 mm |
Imilinganiselo | L685*W635*H960 mm |
Izivamvo | 1 pc |
Ubunzima | 76kg |