Uphawu
Izinto eziluncedo zomvavanyi wovavanyo olubhabhayo:
Uphuhliso lovavanyo olukhawulezayo;iindlela zokuvavanya ixabiso eliphantsi;ukuguquguquka kokutshintsha ngokukhawuleza;kunye nempendulo ekhawulezayo kubaqulunqi ngexesha lesigaba somzekelo.
Abavavanyi beebhedi ezi-6 okanye ezi-8 Abavavanyi be-Flying probe banokusebenzisa uvavanyo olumacala omabini, njengovavanyo lwebhedi yezikhonkwane, ukonga ixesha lokuguqula ibhodi.
Abavavanyi abatsha be-flying probe basetyenziselwa imisebenzi yokumisa ethambileyo, kwaye amandla entwasahlobo e-spring probe anokwehliswa abe yi-10g (0.1N).Nangona ixesha lovavanyo lonyuswe kancinci, uphawu lokugqobhoza luphantse lungabonakali.
Ke ngoko, xa kuthelekiswa ne-ICT yemveli, ixesha elifunekayo kuvavanyo lokubhabha lokubhabha lingaphezulu kwembuyekezo ngokunciphisa ixesha lovavanyo lilonke.
Iingenelo zokusebenzisa inkqubo yovavanyo lwe-flying probe izodlula iintsilelo.Ngokomzekelo, inkqubo enjalo ibonelela ngenkqubo yokuhlanganisana ukuqala ukuvelisa kuphela iiyure ezimbalwa emva kokufumana ifayile yeCAD.Ke ngoko, iibhodi zeprototype zinokuvavanywa iiyure emva kokuhlangana, ngokungafaniyo ne-ICT, apho uphuhliso lovavanyo oluxabisa kakhulu kunye nokulungiswa kunokulibazisa inkqubo kangangeentsuku okanye iinyanga.Iinkqubo zokuvavanya i-Flying probe nazo zinciphisa ixesha lokuhlola elibonakalayo "inqaku lokuqala" leemveliso ezintsha, okubalulekileyo kuba ibhodi yokuqala ihlala imisela iimpawu zovavanyo lwe-UUTs eseleyo.
【Ezona mpawu】
①Iiprobe ezisibhozo kwicala eliphindwe kabini ngexabiso elingcono
② Ukuchaneka okuphezulu (iphakheji ye-01005 exhaswayo)
③ Indlela yomzila kaloliwe echanekileyo enokubekwa kwakhona kokuchaneka okuphezulu
④ Uthumelo lwe-Intanethi / lwangaphakathi luyaxhaswa
⑤ Ukuhanjiswa okuthe tyaba
⑥ Uvavanyo lwe-LCRD olungatshintshiyo luyaxhaswa
Umfanekiso weenkcukacha
Iinkcukacha
| Umzekelo | I-TY-8Y | |
| Ubalo oluphambili | Ubuncinci beChip | 01005 (0.4mm x 0.2mm) |
| Min Compenent Pin Isithuba | 0.2mm | |
| Min Qhagamshelana Pad | 0.15mm | |
| Probes | Iintloko ezi-4(Phezulu)+Iintloko ezi-4(Ezantsi) | |
| Probe amandla elastic | 120g (Ehlala ikho) | |
| Probe Rated Stroke | 1.5mm | |
| Iintlobo zamanqaku avavanywayo | Amanqaku ovavanyo, iiPads, iDlectrodes yeSixhobo Iziqhagamshelo, Amacandelo angaqhelekanga | |
| Isantya sokuvavanya | Max 25 Amanyathelo/Sec | |
| Ukuphindaphinda | ±0.005mm | |
| Ibhanti liphezulu | 900±20mm | |
| Ibhanti Ububanzi | 50mm ~ 630mm | |
| Uhlengahlengiso lobubanzi bokulandelela | Ngokuzenzekelayo | |
| Imowudi yangaphakathi Imo engasebenziyo | Ekhohlo (Ekunene) Kuyo, Ekunene (Ekhohlo) Ngaphandle Ushiye ngaphakathi, Ushiywe ngaphandle | |
| Amehlo | Ikhamera | Iikhamera ezi-4 eziMbalabala, iiPixels eziyi-12M |
| I-Laser Displacement Sensor | 4 Iiseti | |
| Indawo yoVavanyo | Indawo yovavanyo oluphezulu | 640mm x 600mm |
| Indawo yoVavanyo encinci | 60mm x 50mm | |
| TOP Clearrance | ≤50mm | |
| I-BOT Clearrance | ≤50mm | |
| Umda weBhodi | ≥3mm | |
| Ukutyeba | 0.6mm ~ 6mm | |
| Max PCBA Ubunzima | 10kg | |
| Intshukumo Iiparamitha | Probe Return Height | Icwangcisiwe |
| Phanda ngokucofa ubunzulu | Icwangcisiwe | |
| Probe Soft Landing | Icwangcisiwe | |
| Z Umgama | -3mm ~ 53mm | |
| XY / Z Ukukhawuleza | Ubuninzi 3G / Max 20G | |
| XYZ Umqhubi | IiMoto zomgca | |
| XYZ umlinganiselo | Isikali somgca | |
| Umzila kaloliwe weXY | Umzila wesikhokelo esichanekileyo se-P-Grade | |
| Uvavanyo Ukubanakho | Abaxhathisi | 1mΩ ~ 1GΩ |
| IiCapacitors | 0,5pF ~ 1F | |
| Ii-inductors | 0.5uH ~ 1H | |
| IiDiodes | Ewe | |
| Zener diode | 40V | |
| BJT | Ewe | |
| Udluliselo | 40V | |
| IiFET | Ewe | |
| Umthombo wangoku we-DC | 10nA ~ 1A | |
| Umthombo we-DC Constant Voltage | 0 ~ 40V | |
| Umthombo wangoku we-AC | 100 ~ 500mVrms(200hz ~ 1Mhz) | |
| Uvavanyo lwePhaneli | Ewe | |
| Ibhakhowudi ye-2D | Ewe | |
| PCBA Deformation Imbuyekezo | Ewe | |
| UQhagamshelwano lwe-MES | Ewe | |
| Uvavanyo lwe-LED | Ukhetho | |
| Vula iphini | Ukhetho | |
| Kwinkqubo yebhodi | Ukhetho | |
| IVayo DFT (6 CAD) | Ukhetho | |
