Ukuphumelela ngempumelelo i-solder surface mount components kwibhodi yesekethe, ubushushu kufuneka budluliselwe kwi-solder alloy paste de ubushushu bayo bufikelele kwindawo etyhidiweyo (217 ° C ye-SAC305 lead free solder).I-alloy engamanzi iya kudibana kunye neepads zobhedu ze-PCB kwaye ibe ngumxube we-eutectic alloy.Ijoyinti eqinileyo yesolder iya kwenziwa emva kokuba iphole ngezantsi kwenqaku elinyibilikileyo.
Zintathu iindlela zokudlulisa ubushushu ukusuka kwindawo yobushushu ukuya kwizinto ezishushu.
- Ukuqhuba: I-Thermal conduction ihambisa ngokuthe ngqo ngento xa kukho umahluko weqondo lobushushu phakathi kwemimandla edibeneyo, ngaphandle kokushukuma kwezinto.Kwenzeka xa izinto ezimbini kumaqondo obushushu ahlukeneyo zidibana enye kwenye.Ubushushu buhamba busuka kwindawo eshushu ukuya kwinto epholileyo de zibe zombini zikwiqondo lobushushu elifanayo.
- Imitha: Ukuhanjiswa kobushushu ngemitha kwenzeka ngendlela yamaza ombane we-electromagnetic ikakhulu kwingingqi ye-infrared.Imitha yindlela yokudlulisa ubushushu engaxhomekekanga kulo naluphi na uqhagamshelwano phakathi komthombo wobushushu kunye nento eshushu.Umda wemitha yemitha kukuba umzimba omnyama uya kutsala ubushushu obuninzi kunomzimba omhlophe.
- I-Convection: Ukuhanjiswa kobushushu kukudluliselwa kobushushu ukusuka kwenye indawo ukuya kwenye ngokushukuma kolwelo olufana nomoya okanye igesi engumphunga.Ikwayindlela yokungaqhagamshelwanga ukudlulisa ubushushu ngokunjalo.
Isolder yanamhlanjereflow ovensebenzisa iikhonsepthi zemitha kunye ne-convection zidibene.Ubushushu bukhutshwa yinto yobushushu beceramic enemitha ye-infrared, kodwa ayizisi kwi-PCB ngqo.Ubushushu buya kudluliselwa kwisilawuli sobushushu kuqala ukwenza ubushushu bulingane.I-fan ye-convection iya kuvuthela umoya oshushu kwigumbi elingaphakathi.I-PCB ekujoliswe kuyo inokufumana ukuhambelana kobushushu kuyo nayiphi na indawo.
Ixesha lokuposa: Jul-07-2022