1. Isitampu:
a.Kulula ukuba kubangele PCBA wesekethe ukwaphuka umaleko, njl.;
b.Ukusebenza okuphezulu;
c.Ukuchaneka akunakulawulwa kwaye ukhuseleko luphantsi;
2. Ibhodi ye-V-CUT:
a.Kulula ukuyonakalisa i-PCBA kwaye ushiye i-burrs emva kokusika;
b.Ukusebenza okuphezulu kunye nothuli olungalawulekiyo;
c.Ifakwe kwi-V-CUT groove design;
3. Ibhodi yokuqhawula i-Milling cutter
a.Ukusika ngaphandle kwe-burrs, uxinzelelo oluphantsi kunye nokuchaneka okuphezulu;
b.Ukulawula ngokufanelekileyo uthuli kwaye uthintele uthuli ekuweni phezu kobuso besixhobo;
c.Ngaba ukusika PCBA iimilo ezahlukeneyo, ixhotyiswe inkqubo yembuyekezo ebonakalayo;
4. Ukuqhekeka kweLaser
a.Uxinzelelo oluphantsi;
b.Kukho i-carbonization kunye nobumnyama phezu komhlaba emva kokusika;
c.Ukusebenza okuphantsi kokusika kunye neendleko eziphezulu;
Ixesha lokuposa: Jun-14-2023