Ireflow ovenukufudumeza kuqala sisenzo sokufudumeza esenziwe ukuze kusebenze intlama yesolder kwaye kuthintelwe ukusilela kwamalungu okubangelwa kukufudumala okukhawulezileyo kobushushu obuphezulu ngexesha lokuntywiliselwa kwetoti.Injongo yale ndawo kukutshisa i-PCB kwiqondo lokushisa ngokukhawuleza, kodwa izinga lokushisa kufuneka lilawulwe ngaphakathi koluhlu olufanelekileyo.Ukuba ikhawuleza kakhulu, ukutshitshiswa kwe-thermal kuya kwenzeka, kwaye ibhodi yesekethe kunye namacandelo anokonakala.Ukuba icotha kakhulu, i-solvent ayiyi kunyuka ngokwaneleyo, eya kuchaphazela umgangatho we-Welding.Ngenxa yesantya sokufudumeza ngokukhawuleza, ukuhluka kweqondo lokushisa kwigumbi lokutshisa i-reflow kwindawo yokugqibela yendawo yokushisa inkulu.Ukuze kuthintelwe umonakalo wamacandelo ngenxa yokutshatyalaliswa kwe-thermal, izinga eliphezulu lokufudumala lichazwe ngokubanzi njenge-4 ° C / S, kwaye izinga eliqhelekileyo lokunyuka libekwe kwi-1 ~ 3 ° C / S.
Ixesha lokuposa: Aug-24-2022