Njengoko izithako ze-Sn eziqulethwe ngaphezu kwe-95% kwi-solder ye-lead-free ye-SnAgCu, ngoko xa kuthelekiswa ne-solder yendabuko, ukwanda kwezithako ze-Sn kunye nobushushu benkqubo ye-Lead-free solder iya kubangela i-oxidation ye-solder eyandayo. ukunciphisa i-oxidation ye-solder slag, i-dross, kufuneka siqale siqonde iintlobo kunye neenkqubo zokubumba.
Ezi zintathu zilandelayo ziya kuqwalaselwa:
(1) Umphezulu we-static wefilimu ye-oxide, le yinto yendalo ye-Sn oxide, ukuba nje ifilimu ye-oxide ingaphulwanga, kuba iya kuthintela ukuveliswa okungakumbi komthamo we-oxidation.Njengoko kubonisiwe ngezantsi:
2Njengoko kubonisiwe kulo mfanekiso ungezantsi:
(3) Intsalela yekhudi yembotyi, ibikumbhobho wombhobho wamaza aziphithizelayo kunye namaza oxolo, ebangela ubuninzi bobunzima bonke be-oxide slag.
Intsalela yebhontshisi ye-curd ibangwe luxinzelelo olubi lweoksijini yokucheba i-slag, kunye nesiphumo sokuwa kwamanzi kwisiphumo esidityanisiweyo sezinto ezahlukeneyo, inkqubo ethile eguqukayo yile ilandelayo:
Ummandla omnyama lujongano lomoya, iqondo lobushushu lolwelo liwisa elimhlophe Sn.t = T3 umzobo sinokubona inxalenye encinci yomoya iginywe kwisisombululo se-solder, inxalenye encinci yomoya ngenxa ye-oxidation esheshayo ye-oksijini ngaphakathi kwe-tin iya kudlula kodwa ayikwazi ukuphelisa i-N2 igesi, kwaye ngoko yenza iibhola ezingenanto. , Ekubeni ubuninzi bebhola obumngxuma buncinane kakhulu kunobo betoti, umphezulu wetoti unyanzelekile ukuba uvele xa le bhola igoxo ikhe yapakishwa ukwenza ukudada kumphezulu wenkonkxa yebhontshisi.
Ukwazi oonobangela kunye neentlobo zokwenza inkonkxa, sikholelwa ukuba ukunciphisa ukubunjwa kwentsalela ye-Bean curd kukunciphisa i-wave soldering tin slag eyona milinganiselo isebenzayo.Ukusuka apha ngasentla kunokubonwa inkqubo eguquguqukayo: umngxuma weebhola ze-solder ziimeko ezimbini eziyimfuneko:
Imfuneko yokuqala yimpembelelo yomda, i-tin surface kunye ne-dramatic roll, eyenza i-phagocytosis.
Imfuneko yesibini yibhola engenanto ngaphakathi ukwenza ifilimu ye-oxide exineneyo, igesi ye-nitrogen yenziwa ngaphakathi kwepakethe.Kungenjalo idada kumphezulu wesolder xa ibhola enomngxuma iya kwaphuka, ingakwazi ukwenza "intsalela yekhudi yembotyi."
Ezi meko zimbini ziyimfuneko ziyimfuneko.
Amanyathelo okunciphisa intlenga kwi-soldering soldering ibonisa ngolu hlobo lulandelayo:
I-1.Ukunciphisa i-gap eveliswayo xa utshintshisa i-wave, eya kuncitshiswa i-reflow solder bump imizamo yokunciphisa umqulu, ngokunciphisa isizukulwana se-phagocytosis.
Ke sitshintshe icandelo lomnqamlezo wembiza ye-solder kwi-trapezoid, kwaye senze i-wave yokuqala kangangoko kunokwenzeka kufutshane nomphetho wembiza ye-solder.
2. Kuzo zombini i-wave yokuqala kunye ne-wave yesibini songeza isixhobo somqobo esingahluzwanga kwi-solder-flow flow solder.
3. Thatha ukhuseleko lwe-N2 ukuze ugweme ukuveliswa kweembrane ezixineneyo ze-oxide kwibhola ye-solder.
Ixesha lokuposa: Mar-22-2022