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1. Ukubunjwa kwenkqubo yothutho: kubandakanywa iileyili zesikhokelo sothutho, iipuli zothutho kunye namabhanti, iimoto ze-DC, izixhobo zebhodi yokumisa kunye nezixhobo zokuhlengahlengisa ububanzi bomzila kaloliwe, njl. ukuziqhelanisa nobukhulu obahlukeneyo iibhodi zesekethe PCB
2. Ukuqulunqwa kwenkqubo yokumisa i-stencil: kubandakanywa ne-PCB yensimbi ye-stencil ehambayo kunye nesixhobo sokulungisa i-stencil, njl.
3. Ukuqulunqwa kwenkqubo ye-PCB yokubeka indawo: amacandelo ebhokisi ye-vacuum, iqonga le-vacuum, i-thimble magnetic kunye nesixhobo sokuphatha ibhodi eguquguqukayo, njl. izixhobo ze-adsorption, ezinokuthi zilawule ngokufanelekileyo ukuthambeka kwe-PCB substrates kwaye zithintele i-tinning engalinganiyo ebangelwa yi-PCB deformation.Ukuthengiswa kobuxoki kwenzeka ngexesha lokubekwa kwe-SMT.
4. Ukuqulunqwa kwenkqubo yombono: kubandakanywa inxalenye ye-CCD eshukumayo, isixhobo se-CCD-Camera (ikhamera, umthombo wokukhanya) kunye nomboniso ophezulu, njl.Umsebenzi: inkqubo yokujonga phezulu / ezantsi, ukukhanya okuzimeleyo kunye nokulungelelaniswa kokukhanya kunye ne-lens ehamba phambili ye-speed-speed ukuqinisekisa ukulungelelaniswa okukhawulezayo nokuchanekileyo kwe-PCB kunye ne-stencil, iteknoloji yokuqaphela umfanekiso ongenamkhawulo kunye nokuchaneka kokuchaneka kwe-0.01mm.
5. Ukuqulunqwa kwenkqubo ye-scraper: kubandakanywa intloko yokushicilela, i-scraper beam kunye ne-scraper drive part (i-servo motor kunye ne-synchronous gear drive), njl. ukwenza uqhagamshelwano lwe-stencil kunye ne-PCB, i-scraper ityhala i-solder paste kwi-stencil ukuba iqhube phambili, kwaye kwangaxeshanye yenza i-solder paste igcwalise ukuvulwa kwe-stencil, xa ithemplate ikhutshwa kwi-PCB, ubukhulu obufanelekileyo be-solder. coma ishiywe kwi-PCB ehambelana nepateni yethempleyithi.I-scrapers ihlulwe kwi-metal scrapers kunye ne-rubber scrapers, ezisetyenziswa kwiimeko ezahlukeneyo.
Ixesha lokuposa: Aug-29-2023