I-3D SPI (Ukuhlolwa Kwe-Solder Namathisela)Umshini TY-3D200
Imininingwane
Ipharamitha yamandla okuthola izisetshenziswa | INDLELA | I-TY-3D200 Standard Monorail |
Ubukhulu be-PCB | 0.6 ~ 5.0mm | |
Isisindo sepuleti le-PCB | 5.0 Kg | |
Ubude obuvumelekile be-PCB | PHEZULU: 20mm, Phansi: 25mm | |
Ububanzi bonqenqema be-PCB | 3mm | |
Ubude obukhulu bokunamathisela ithini | 500um | |
Ubuncane bosayizi we-PCB | 55mm*55mm | |
Ubukhulu besayizi ye-PCB | 400*330 | |
Ingxenye encane eguqukayo | 01005 | |
Uhlobo olubi lokutholwa | Ithini elincane, ukuphrinta okushodayo, isifunda esifushane, i-offset | |
Izinto zokuhlola ezijwayelekile | Indawo, isikhundla, ukuphakama, ivolumu, isifunda esifushane | |
Ubude bokunamathisela ithini | 0~500um | |
Isinxephezelo sokugoba amapuleti | 5mm | |
Umsebenzi wokwabelana wedatha ye-Bad Mark nomshini wokubeka | Ongakukhetha | |
| Umgomo wokutholwa | Indlela yokukala Umngcele weVector yombala |
Ibhrendi yekhamera | I-ID yesiJalimane | |
Iphikseli yekhamera | 5M Pixel | |
isithombe se-monochrome | Be | |
isithombe sombala | Be | |
ukulungiswa kwe-optical | 8μm/12μm /13.8μm/14.5μm/16.3μm | |
FOV SIZE | 28mm/35mm/37mm/41mm | |
Inani lemithombo yokukhanya | 6 umthombo wokukhanya | |
Ibanga lokuthola ubude | 0-300um | |
Isivinini sokuthola | 0.35s/FOV | |
Isofthiwe | Ulimi lwesoftware | IsiShayina / IsiNgisi |
Isofthiwe yokuhlela | Uhlelo olungaxhunyiwe ku-inthanethi | |
Isikhathi sokuhlela | 5 ~ 20 imizuzu | |
Isikhathi sokuhlela kahle uhlelo | 1 ~ 10 amaminithi | |
Isikhathi sokushintsha ulayini | 1 ~ 10 amaminithi | |
Imodi yokuhlela, uhlobo lokufakwayo kwedatha | I-GerberData 274D / 274X, ukuhlela isithombe sedivayisi | |
Isoftware yokuhlela engaxhunyiwe ku-inthanethi | Ongakukhetha | |
Ubulula bokusebenza | elula futhi elula | |
Ukutholwa nokuhlaziywa kwedatha ye-SPC | I-SPC ejwayelekile | |
Izidingo zobuchwepheshe zenethiwekhi | Izidingo ezijwayelekile | |
Uhlelo lwemishini | Isakhiwo esikhulu semishini | i-monoblock cast |
Imodi ye-Orbital | I-Monorail / ithrekhi emibili | |
Indlela ye-XY | I-integral casting, intambo yocingo, isitimela somhlahlandlela | |
Umhlahlandlela wemodi yokulungisa ububanzi besitimela | Ukunwetshwa okwenziwa ngesandla / okuzenzakalelayo | |
Ukuma kwe-PCB kanye nemodi yokubopha | Isikhundla esiphezulu, i-cylinder clamping | |
Ubude besitimela somhlahlandlela | 880-920mm | |
PCB yokudlulisela isiqondiso | Okujwayelekile: kwesobunxele kuya kwesokudla | |
Ikhompyutha | Umsingathi | Umsingathi onguchwepheshe i7 CPU |
Amandla enkumbulo | 16G noma ngaphezulu | |
Umthamo we-hard disk | 1TB | |
Isistimu yokusebenza (OS) | Windows7 X64 NOMA Windows10 X64 | |
Inkomba | 22' LCD (1920X1080) | |
Ukuskena kwekhodi yebha / inethiwekhi yesizindalwazi | Ongakukhetha | |
Izidingo zezisetshenziswa | Usayizi wesisetshenziswa (W*D*H) | 630*1620*1470 |
Amandla | I-AC220V/1000VA | |
Umfutho womoya osebenzayo | 0.5mpa | |
Ukuma kwe-PCB | Ukuma kusilinda | |
Isisindo sesisetshenziswa (Kg) | 1100kg | |
Isevisi | Isevisi yokuthuthukisa isofthiwe | Inguqulo yamahhala yokuphila konke kwamahhala |
Isevisi yangokwezifiso | Ukwenza ngokwezifiso okusebenzayo | |
Izinto ezifanayo | Idivayisi noma isofthiwe yokuskena ikhodi yebha, imojuli yedatha ye-BAD MARK, ukuxhumana kwephrinta, ukuhlela ungaxhunyiwe ku-inthanethi noma indawo yokusebenza yokulungisa, ukwenza ngokwezifiso isofthiwe ye-SPC, ukuhlolwa kokuqagela kwe-3D, insizakalo yewaranti yomshini enwetshiwe, ukwenza ngokwezifiso umsebenzi wesofthiwe, ukuhlola ngokunemba / ithuluzi lokulungisa, umsebenzi we-NG / OK BUFFER , isibonisi sokuqapha esikabili; |