Isici
●Izifudumezi ezizimele ezi-3
① Izifudumezi eziphezulu nezingaphansi ziwukushisa komoya oshisayo, i-IR yesithathu(indawo yokushisa350x260mm)ukufudumeza kwe-infrared, ukunemba kwezinga lokushisa ngaphakathi ±3℃, ama-heaters aphezulu naphansiukubeka 6 amasegimenti izinga lokushisa elikhulayo kanye 6 izingxenye lokushisa umsebenzi, kungagcina amaqembu 50 lokushisa Curves for ezahlukene BGA chips.
②it ingafudumeza i-PCBibhodi kanyeBga chips ngesikhathi esifanayo.Futhi i-heater yesithathu ye-IR canukushisa kuqala ibhodi le-PCB kusuka phansi, ukuze ugweme i-PCB ekuguqukeni phakathi nenqubo yokulungisa.Iama-heaters aphezulu naphansi ashisa ngokuzimela;
③ ukusetshenziswa kwamandla kwe-heater yesithathu ye-IR kungashintshwa, yenze ibhodi le-PCB lishise ngokulinganayoly, gwemaPCB kusukaukuguquguquka.
④ Inzwa yangaphandle ingakwazi ukubona izinga lokushisa ngokunembile, ihlaziye futhi ilinganise ijika langempela lokushisa ngokunembilenganoma yisiphi isikhathi.
●Mi-ulti-functionali-hommization uhlelo
① I-AdoptI-Taiwanisixhumi esibonakalayo somshini womuntu, i-thermocouple yohlobo lwe-K enembayo ephezulu evalekile-isilawuli se-loop, izinga lokushisa eliboniswa esikrinini sokuthinta, i-heater ephezulu ingahanjiswa ngokukhululekile;heater phansi canbe lungisaed phezulu naphansi.
② Yamukelwa yonke inhlobosama-nozzles e-BGA, nge360° ukuzungezisa, kululaokwefakai-ationfuthi esikhundleniingqondo, okwenziwe ngezifiso kuyatholakala;
③ Kukhona ishalofu lokusekela le-BGA lokunamathiselaukusekelaPCBibhodi;
④ Multi-functionalIshalofu lokusekela le-PCB, lingahambadeduze kwe-X eksisi,ngengokushesha futhi kulula ukuma kwebhodi le-PCB, ilungele lonke uhlobo lwesikhundla se-PCB;
⑤ I-cross-flow fan enamandla ipholisa ibhodi le-PCBngokusheshangemva desoldering futhi soldering, kungaba ukuvimbela ibhodi PCBkusukaukuguquguquka;ngeiphampu ye-vacuum kanye nepeni lokudonsa le-vacuum langaphandleto thatha ama-chipskahle.
●Imisebenzi yokuphepha ephezulu
WithiIsitifiketi se-CE;ngemva kokudilizwa kanye ne-soldering, kukhona okwethusayo.lapho izinga lokushisa liphuma ekulawuleni;isekethe izocisha ngokuzenzakalelayo, iphindwe kabilingaphezulu-umsebenzi wokuvikela izinga lokushisa.Ipharamitha yezinga lokushisa inephasiwedi okufanele igwenywekusukaizinguquko ezingahleliwe, ezinemisebenzi ephakeme yokuvikela ephephile, zingavikela i-PCBibhodiizingxenye kanye nomshini ekulimaleni kunoma yisiphi isimo esingavamile.
●Ikhamera
2 million pixels
Ukwahlukaniswa Komkhiqizo Ikhamera ye-VGA
Usayizi wenzwa 1/3 intshi
Amaphikseli asebenzayo I-HD Egcwele
Isixazululo 1920*1080@30FPS
Isixhumi esibonakalayo se-VGA, i-USB2.0
Usayizi wephikseli 2.75* 2.75 μm
Ukunikezwa kwamandla DC-12V/1A
Imininingwane yesithombe
Imininingwane
Imodeli | I-TY-2860C |
amandla | I-AC220V±10%50/60Hz |
Amandla Aphelele | Ubukhulu 4800 W |
Amandla heater | iheater ephezulu 800W iheater engezansi 1200W IR heater 2700W |
Izinto zikagesi | Isikrini sokuthinta+Ukunemba okuphezulu kwe-intelligent Imodyuli yokulawula izinga lokushisa |
Ukulawula izinga lokushisa | I-thermocouple yohlobo lwe-K (Iluphu evaliwe) |
Ukuma | I-V-groove, ukwesekwa kwe-PCB |
Usayizi we-PCB | Ubukhulu 410*370 mm Amaminithi angu-20*20 mm |
I-chip ye-BGA | L630*W610*H690 mm |
Wayisishiyagalombili | 48kg |