Isiteshi sokusebenza kabusha se-BGA esinokuqondanisa okubonakalayo kwe-TY-7220A

Isicelo somkhiqizo

1. I-Desolder kanye ne-solder yonke i-BGA Chip, susa futhi ulungise i-chip ye-motherboard ye-BGA IC ehlukile nezinye izingxenye (Lead free & lead iyatholakala).

2. Ingehlisa izindleko zokukhiqiza ekusebenzeni kabusha kwe-IC Chip yokusoda embi phakathi nenqubo yokuhlanganisa i-PCB.

3. Ngesistimu yokuqondanisa ye-Optical, ungakwazi kabusha i-BGA kalula, futhi uvikele amehlo akho abuthakathaka.

4. Ingasebenza kabusha i-BGA, i-LED, i-IC namanye ama-micro chipsets ngokunemba okuphezulu.Ikakhulukaziisudi yokulungiswa kabusha kwebhodi lomama ngokunemba okuphezulu, yakhelwe ukusebenza kabusha okunembayo.

5. Isetshenziselwa kakhulu ukulungisa kabusha i-chipset ye-BGA ku-laptop, PS3, PS4,XBOX360,Iselulaifoni, njll.

6. Sebenza kabusha i-micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, njll.

Izici eziyinhloko

Indawo enkulu ye-infrared carbon fiber Pre-heating system, enenzuzo yokushisisa kwangaphambilini ngokushesha nangokulinganayo futhi akukho ukungcoliswa kokukhanya.

Amapharamitha wezinga lokushisa avikelwe imikhawulo yegunya, ngokugwema izilungiselelo zamaphutha.

Izingxenye eziyishumi zenqubo yokulawula izinga lokushisa, ezifanele zonke izinhlobo ze-BGA Rework.

Isitoreji esingenamkhawulo sephrofayili yezinga lokushisa, udinga nje ukucindezela ukhiye owodwa ukuze usebenzise iphrofayili.

Izinzwa ezintathu zohlobo lwe-K ezitholakalayo zingakwazi ukubona izinga lokushisa elinembayo eliphezulu lephoyinti ngalinye le-PCB noma i-BGA, futhi i-PC ingakhiqiza umbiko wokuhlaziya amajika ngokuzenzakalelayo.

I-desoldering kanye ne-soldering ngokuzenzakalelayo, Asikho isidingo sokulungiswa kwesandla

Ukugeleza komoya oshisayo kungalungiseka ukuze kuhlangatshezwane nesidingo sanoma yimaphi ama-chips

I-USB Connection ayinamshayeli, isilawuli se-PC

Isilawuli sokuphakamisa umoya oshisayo esiphansi esitholakala kuphaneli yangaphambili, kulula ukuyilungisa nganoma yisiphi isikhathi.

Ukuma kwe-laser kuyatholakala, ukwenza ukuma kusheshe.

Izici ziyethula

●Izifudumezi ezizimele ezi-3

① TIzifudumezi ze-op nezansi ziwukushisa komoya oshisayo, i-IR yesithathuihithaUkushisisa nge-infrared, izifudumezi eziphezulu naphansi zingashisisa i-PCB ukusuka phezulu kanye no-bi-ottomkweiNgisikhathi esifanayo.ukunemba kwezinga lokushisa ngaphakathi ±3℃,banguokuningiizingxenye zingasethwa kuiNgisikhathi esifanayo;Indawo yokushisisa ye-IR iyalungiseka ngokuyato izicelo zokufisa, ukwenza ukushisa kwe-PCB kulinganely.

②It ingafudumeza i-PCBibhodi kanye nama-bga chips ngesikhathi esifanayo.Futhi i-heater yesithathu ye-IR canukushisa kuqala ibhodi le-PCB kusuka phansi, ukuze ugweme i-PCB ekuguqukeni phakathi nenqubo yokulungisa.Iama-heaters aphezulu naphansi ashisa ngokuzimela;

③Ci-accura ephezuluteK thayipha i-close-loop thermocouple, namapharamitha e-PID ngokuzenzakalelayoauhlelo lokulungisa;ingakhombisaamajika okushisa ayisikhombisa kanye nesigidis kwe giqembusidatha ingagcinwangokusebenzisaUmshini wokulondolozae,ngeUmsebenzi wokuhlaziya amajika asheshayofuthiukuhlaziya izinga lokushisa le-BGA nganoma yisiphi isikhathi;inzwa okokuhlola izinga lokushisa okunembile.

●Isistimu yokuqondanisa i-optical enembile

AIsistimu yokubona yombala we-CCD eguquguqukayo eguquguqukayo, enokuhlukaniswa kwe-beam, sondeza, hlehlisa isithombe kanye nemisebenzi yokuguqula kancane, inokusebenza okuzenzakalelayo.i-chromatismisixazululo kanyeelikhanyayonessukulungisauhlelo,khulisaukuya ku-230 X, ukunemba okukhuphuka ngaphakathi±0.02mm.

●Uhlelo lokusebenza lwe-Multi-function

①Yamukela isixhumi esibonakalayo somshini womuntu, esitholakalayo ukuze simiswe“misa”futhi“sebenza”ukuze ugweme izilungiselelo zephutha, Idivayisi ye-heater ephezulu kanye nekhanda elikhuphukayo elingu-2 kumklamo ongu-1, eline-othomathikhi yokuhlonza ama-chip e-BGA nokuphakama okukhuphukayo, iwukusoda okuzenzakalelayo kanye nokudiliza umsebenzi.ingasetha amasegimenti angu-6 okukhuphuka kwezinga lokushisa kanye namasegimenti angu-6 okushisa komsebenzi, futhi ingakwazi gcina amaphrofayili okushisa we-N amaqembu.Kuthathwe zonke izinhlobo ze-BGA nozzles, ezinama-360° ukujikeleza, kulula ukufakwa nokushintshwa, okwenziwe ngezifiso kuyatholakala;

②Ukusekelwa kwe-PCB ye-V-groove, enendawo esheshayo, elula futhi enembile, ingalingana nazo zonke izinhlobo zebhodi le-PCB;Ukulungiswa kwendawo yonke eguquguqukayo nesusekayo kunemiphumela yokuvikela futhi akukho monakalo ebhodini le-PCB, elifanele zonke izinhlobo zosayizi bokulungisa i-BGA.

●Imisebenzi yokuphepha ephezulu

Ngesitifiketi se-CE;ngemva kokudilizwa kanye ne-soldering, kukhona okwethusayo.lapho izinga lokushisa liphuma ekulawuleni;isekethe izocisha ngokuzenzakalelayo, iwumsebenzi wokuvikela izinga lokushisa eliphindwe kabili.Ipharamitha yezinga lokushisa inephasiwedi okufanele uyigwemeizinguquko ezingafanele, ngemisebenzi ephakeme yokuvikela ukuphepha, ingavikelaIzingxenye zebhodi le-PCB kanye nomshini wokulimala e noma yisiphi isimo esingavamile.