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Ukunemba kwe-optical imaging
Isakhiwo esinezinhlangothi ezimbili: amakhamera ezinhlangothini zombili ahamba ngesikhathi esisodwa, athwebula izithombe ngesikhathi esisodwa, futhi abone izinhlangothi zombili ngesikhathi esisodwa, afinyelele isivinini esikhulu kuyilapho eqinisekisa umphumela wokuthwebula izithombe.
Ilensi ye-Telecentric: ithwebula izithombe ngaphandle kwe-parallax, igwema ngempumelelo ukuphazamiseka kokubonisa, inciphisa izingxenye ezinde, futhi ixazulula inkinga yokujula kwensimu.
Amakhamera ezimboni athatha izithombe ezinesivinini esikhulu futhi athwebule izithombe ezinencazelo ephezulu
Umthombo wokukhanya wombhoshongo onemibala emithathu i-RGB ye-LED enemibala emithathu kanye nomklamo wenhlanganisela omise okwezingela eziningi ungabonisa ngokunembile ulwazi lweleveli yemithambeka yendawo yento.
I-Collinearity:Umucu wokukhanya we-backplane we-LED udinga ukubona i-offset ehlobene yama-LED amabili ukuze kuqinisekiswe ukuthi wonke umugqa wokukhanya we-LED uyi-collinear, eyixazulula kahle inkinga yemboni yokuhlola ukusatshalaliswa kwe-S-type non-collinear LED, okufeza i-LED collinearity engasondelene. ukuhlaziya nokwahlulela.
Ukuhlonza inani le-resistor:Le-algorithm isebenzisa ubuchwepheshe bakamuva bokuhlonza umshini ukubala inani elinembile lokumelana nezici zikagesi ze-resistor ngokuhlonza izinhlamvu eziphrintwe ku-resistor.Le algorithm ingasetshenziswa ukuthola izingxenye ezingalungile ze-resistor, futhi ngesikhathi esifanayo ibone ukufanisa okuzenzakalelayo komsebenzi "wezinto ezithatha indawo".
Ukutholwa kokuklwebheka:Le algorithm izosesha imigqa emnyama yobude obucacisiwe endaweni eqondiwe futhi ibale inani lokukhanya elimaphakathi lendawo yomugqa omnyama.Le algorithm ingasetshenziswa ukuthola imihuzuko, imifantu, njll. endaweni eyisicaba.
Iukwahlulela okuhlakaniphile:Le algorithm iqoqa amasampula ezithombe afanelekayo nezingalungile ngokulandelana, isungula imodi yokwahlulela ehlakaniphile ngokuqeqeshwa, futhi ibala ukufana kwezithombe okufanele zihlolwe.Le algorithm ilingisa imodi yokucabanga yomuntu futhi ingaxazulula izinkinga okunzima ukuzibona ngama-algorithms endabuko.Ungakhathazeki.Isibonelo: ukutholwa kokuhlangana kwe-wave solder, setha kabusha ukutholwa kwebhola le-solder, ukutholwa kwe-polarity yezingxenye eziyindilinga, njll.
Imininingwane yesithombe
Imininingwane
Isistimu ye-Optical | ikhamera ye-optical | Amakhamera ezimboni edijithali ayizigidi ezi-5 (izigidi eziyi-10 ngokuzithandela) |
Ukulungiswa (FOV) | Okujwayelekile okungu-10μm/Pixel (ihambisana ne-FOV: 24mm*32mm) 10/15/20μm/Pixel (uma uthanda) | |
i-optical lens | Ilensi ye-telecentric yezinga lamaphikseli angu-5 | |
Isistimu yomthombo wokukhanya | Umthombo wokukhanya we-LED we-coaxial annular ogqame kakhulu we-RGB enama-angle amaningi | |
Ukucushwa kwe-Hardware | isistimu esebenzayo | Windows 10 Pro |
Ukucushwa Kwekhompyutha | i7 CPU, 8G GPU ikhadi lemifanekiso, 16G memory, 120G solid state drive, 1TB mechanical hard drive | |
Ukunikezwa kwamandla omshini | I-AC 220 volts ±10%, imvamisa 50/60Hz, amandla akalwe ngu-1.2KW | |
PCB isiqondiso | Ingasethwa iye kwesokunxele → kwesokudla noma kwesokudla → kwesokunxele ngokucindezela inkinobho | |
Indlela ye-PCB plywood | Ukuvuleka noma ukuvala okuzenzakalelayo kwama-clamp anezinhlangothi ezimbili | |
Indlela yokulungisa i-Z-axis | Ithrekhi engu-1 ilungisiwe, amathrekhi ama-2 azilungiseka | |
Indlela yokulungisa ithrekhi ye-Z-axis | Lungisa ububanzi ngokuzenzakalelayo | |
ubude be-conveyor | 900±25mm | |
umfutho womoya | 0.4~0.8 Imephu | |
ubukhulu bomshini | 1050mm*1120mm*1830mm (L*W*H) Ubude akubandakanyi ukukhanya kwe-alamu | |
isisindo somshini | 600kg | |
Ukucushwa ongakukhetha | Isofthiwe yokuhlela engaxhunyiwe ku-inthanethi, isibhamu sebhakhodi sangaphandle, isixhumi esibonakalayo sesistimu yokulandelelwa kwe-MES sivuliwe, umsingathi wesiteshi sokunakekela | |
Indlela yokuthola phezulu naphansi | Ongakukhetha: vumela ukutholwa okuphezulu kukodwa, ukutholwa okuphansi kukodwa noma ukutholwa okuphezulu nokuphansi ngesikhathi esisodwa. | |
Imininingwane ye-PCB | Usayizi we-PCB | 50*50 mm ~ 450*380 mm (osayizi abakhulu bangenziwa ngokwezifiso ngokwezidingo zamakhasimende) |
Ubukhulu be-PCB | 0.3-6mm | |
Isisindo sebhodi le-PCB | ≤3KG | |
Isisindo sengqikithi | Ukuphakama okucacile okuphezulu ≤ 40mm, ukuphakama okuphansi okucacile ≤ 40mm (izidingo ezikhethekile zingenziwa ngezifiso) | |
Isici sokuhlola esincane | 01005 izingxenye, 0.3 mm ukuphakama nangaphezulu kwe-IC | |
Izinto zokuhlola | Ukuphrinta kokunamathisela kwe-solder | Ukuba khona noma ukungabikho, ukuchezuka, ithini elincane, ithini eningi, isifunda esivulekile, ukungcola, amathani axhunyiwe, njll. |
Amaphutha engxenye | Izingxenye ezingekho, i-offset, ezitshekisiwe, amatshe amathuna, amacele, izingxenye ezigingqikisiwe, i-polarity ehlehlayo, izingxenye ezingalungile, ezilimele, izingxenye eziningi, njll. | |
Ukukhubazeka okuhlangene kwe-solder | Ithini elincane, ithini eningi, ithini eqhubekayo, i-virtual soldering, izingcezu eziningi, njll. | |
Ukuhlolwa kwe-Wave soldering | Ukufaka izikhonkwane, i-Wuxi, ithini elincane, ithini eningi, i-virtual soldering, ubuhlalu bethayela, izimbobo zamathayela, amasekhethi avuliwe, izingcezu eziningi, njll. | |
Ukutholwa kwebhodi lepulasitiki elibomvu | Izingxenye ezingekho, i-offset, i-skewed, amatshe amathuna, izinhlangothi, izingxenye ezigingqikile, i-polarity ehlehlayo, izingxenye ezingalungile, umonakalo, ukuchichima kweglue, izingxenye eziningi, njll. |