1. Ukugxiviza:
a.Kulula ukubangela ukuphuka kwesendlalelo sesekethe ye-PCBA, njll.;
b.Ukusebenza kahle okuphezulu;
c.Ukunemba akukwazi ukulawulwa futhi ukuphepha kuphansi;
2. Ibhodi le-V-CUT:
a.Kulula ukulimaza i-PCBA futhi ushiye ama-burrs ngemva kokusika;
b.Ukusebenza kahle okuphezulu nothuli olungalawuleki;
c.Kufakwe ku-V-CUT groove design;
3. Ibhodi yokuhlukanisa i-Milling cutter
a.Ukusika ngaphandle kwama-burrs, ukucindezeleka okuphansi nokunemba okuphezulu;
b.Lawula ngokuphumelelayo uthuli futhi uvimbele uthuli ekuweleni ebusweni bedivayisi;
c.Ingakwazi ukusika i-PCBA yobujamo obuhlukahlukene, ifakwe uhlelo lwesinxephezelo esibonakalayo;
4. Ukuhlukaniswa kwe-laser
a.Ukucindezeleka okuphansi;
b.Kukhona carbonization kanye blackening ebusweni ngemva kokusika;
c.Ukusebenza okuphansi kokusika kanye nezindleko eziphezulu;
Isikhathi sokuthumela: Jun-14-2023