Ubuhle be-SMTreflow oveninqubo yukuthi izinga lokushisa kulula ukulawula, i-oxidation ingagwenywa ngesikhathi senqubo ye-soldering, futhi izindleko zemikhiqizo yokukhiqiza nazo zilula ukulawula.Kukhona isethi yamasekhethi okushisa kagesi ngaphakathi kwale divayisi, eshisa i-nitrogen ekushiseni okuphezulu ngokwanele futhi ayivuthele ebhodini lesifunda lapho izingxenye zinamathiselwe khona, ukuze i-solder ezinhlangothini zombili zezingxenye incibilike futhi ibophe nge-main. ibhodi.I-TYtechizokwabelana ngenye yezindlela zokuthuthukisa zenqubo yokuphinda kufakwe i-SMT reflow soldering lapha.
1. Kudingeka ukusetha ijika lezinga lokushisa le-SMT le-reflow soldering yesayensi futhi wenze ukuhlola kwesikhathi sangempela kwejika lokushisa njalo.
2. I-Solder ngokuvumelana nesiqondiso sokuphinda sifakwe emanzini ngesikhathi sokuklama kwe-PCB.
3. Ngesikhathi senqubo ye-SMT reflow soldering, ibhande lokudlulisa kufanele livinjwe ukuthi lingadlidlizi.
4. Umphumela we-reflow soldering webhodi lokuqala eliphrintiwe kufanele uhlolwe.
5. Ukuthi i-SMT reflow soldering yanele yini, kungakhathaliseki ukuthi ingaphezulu le-solder joint libushelelezi, kungakhathaliseki ukuthi ukwakheka kwe-solder joint kuyi-half-moon, isimo samabhola e-solder nezinsalela, isimo se-solder eqhubekayo kanye ne-solder ebonakalayo.Futhi hlola izinto ezifana nokushintsha kombala endaweni ye-PCB.Futhi ulungise ijika lokushisa ngokwemiphumela yokuhlola.Phakathi nenqubo yonke yokukhiqiza iqoqo, ikhwalithi yokushisela kufanele ihlolwe njalo.
6. Gcina i-solder egeleza kabusha ye-SMT njalo.Ngenxa yokusebenza isikhathi eside komshini, ukungcola okuphilayo noma okungaphili njenge-rosin eqinile kunamathiselwe.Ukuze uvimbele ukungcoliswa kwesibili kwe-PCB futhi uqinisekise ukuqaliswa okushelelayo kwenqubo, ukugcinwa nokuhlanza njalo kuyadingeka.
Isikhathi sokuthumela: Jan-31-2023