Igama eligcwele le-SMT ubuchwepheshe be-Surface mount.Imishini yangaphakathi ye-SMT isho imishini noma okokusebenza okusetshenziswe enqubweni ye-SMT.Abakhiqizi abahlukene bamisa imigqa yokukhiqiza ehlukene ye-SMT ngokwamandla abo nesikali kanye nezidingo zamakhasimende.Angahlukaniswa abe imigqa yokukhiqiza ye-SMT ezenzakalela kancane kanye nemigqa yokukhiqiza ye-SMT ezenzakalelayo ngokuphelele.Imishini nezinto zokusebenza akufani, kodwa imishini elandelayo ye-SMT iwumugqa wokumisa ophelele futhi ocebile.
1.Umshini wokulayisha: Ibhodi le-PCB lifakwa eshalofini futhi lithunyelwa ngokuzenzakalelayo emshinini webhodi lokumunca.
2.Umshini wokudonsa: thatha i-PCB uyibeke kuthrekhi bese uyidlulisela kuphrinta yokunamathisela ye-solder.
3.Iphrinta yokunamathisela ye-solder: vuza ngokunembile unamathisele we-solder noma namathisela iglu kumaphedi e-PCB ukuze ulungiselele ukubekwa kwengxenye.Imishini yokunyathelisa esetshenziselwa i-SMT icishe ihlukaniswe yaba izinhlobo ezintathu: imishini yokunyathelisa yezandla, imishini yokunyathelisa e-semi-automatic kanye nemishini yokunyathelisa ezenzakalelayo ngokuphelele.
4.SPI: I-SPI isifinyezo se-Solder Paste Inspection.Isetshenziswa kakhulu ukuthola ikhwalithi yamabhodi e-PCB aphrintwe amaphrinta anamathisele we-solder, kanye nokuthola ukushuba, ukucaba kanye nendawo yokuphrinta yokuphrinta kokunamathisela kwe-solder.
5.I-Mounter: Sebenzisa uhlelo oluhlelwe okokusebenza ukuze ufake ngokunembile izingxenye endaweni egxilile yebhodi lesifunda eliphrintiwe.Isikhweli singahlukaniswa sibe isikhwezi sejubane eliphezulu kanye nesixhumi esinemisebenzi eminingi.Isikhwezi sesivinini esikhulu sivame ukusetshenziselwa ukukhweza izingxenye ezincane ze-Chip, umshini wokubeka onemisebenzi eminingi nongenalusizo ikakhulukazi ukhweza izingxenye ezinkulu noma izingxenye zobulili obuhlukile ngendlela yamaroli, amadiski noma amashubhu.
6.Ukuhanjiswa kwe-PCBr: idivayisi yokudlulisa amabhodi e-PCB.
7.Geza kabusha ihhavini: Itholakala ngemuva komshini wokubeka emgqeni wokukhiqiza we-SMT, inikeza indawo yokushisa ukuze incibilike i-solder unamathisele kuma-pads, ukuze izingxenye zokubeka phezulu kanye namapayipi e-PCB ahlanganiswe ngokuqinile nge-solder paste alloy.
8.Isilayishi: Qoqa i-PCBA ngokuzenzakalelayo ngethrekhi yokudlulisa.
9.I-AOI: I-Automatic Optical Identification System, okuyisifinyezo sesiNgisi (I-Auto Optical Inspection), manje isisetshenziswa kabanzi ekuhloleni ukubukeka kwemigqa yokuhlangana yebhodi lesifunda embonini ye-elekthronikhi futhi ingena esikhundleni sokuhlola okubukwayo kwangaphambilini.Ngesikhathi sokutholwa okuzenzakalelayo, umshini uskena ngokuzenzakalelayo i-PCB ngekhamera, uqoqe izithombe, futhi uqhathanise amalunga ahloliwe e-solder namapharamitha afanelekayo kusizindalwazi.Ngemva kokucutshungulwa kwesithombe, amaphutha ku-PCB ayahlolwa, bese kuthi ukonakala kuyavezwa/kumakwe ngesibonisi ukuze kulungiswe uMlungisi.
Isikhathi sokuthumela: Aug-10-2022