I-TYtech E1-V I-Automatic PCB Pick and Place Machine

Lonke uchungechunge lufakwe ama-racks wempahla akhiphekayo: Irekhi yezinto ezibonakalayo + isoftware evamile engaxhunyiwe ku-inthanethi;Yonga ngaphezu kuka-50% wesikhathi sokuguqulwa kokukhiqiza kanye noshintsho lwempahla

Engeza umtapo wezincwadi we-nozzle: Ingakwazi ukusekela ukucaciswa okuhlukene okungu-6 kwamanozzle ku-inthanethi ngesikhathi esisodwa;Izinto ezihlukahlukene zingapakishwa futhi zinamathiselwe ngesikhathi esisodwa ngaphandle kokumisa umshini.

Ikhamera endizayo: Lonke uchungechunge lufakwe ikhamera yendiza ye-laser;Thatha izithombe zamafayela e-CHIP ngaphandle kokuphambuka noma ukuma.

Isistimu yempendulo ye-loop evalwe ngokugcwele: I-XY axis ingeniswe ngokwezifiso izingxenye zerula zokugaya;Ukutholwa kwesikhathi sangempela kanye nesinxephezelo sokuma kwekhanda;Ukunemba kokugcina okuphindaphindekayo kokuma ±35 microns.

Ukunemba kokunyakaza / ukuthuthukiswa kwesivinini: Ukusebenzisa i-loop stepper motor evaliwe;Ukunyakaza kwesivinini esikhulu ngaphandle kokulahlekelwa isinyathelo nokunemba okuphezulu.

Irack yempahla eseceleni okukabili: Ubukhulu besitaki sendawo esingama-58;Ubude bokukhweza bungafinyelela ku-24mm.

Lonke uhlelo lufakwe imithombo yokukhanya yasensimini emnyama: Umthombo wokukhanya we-Darkfield + 5 million ikhamera yedijithali enencazelo ephezulu;Ukuhlonza i-chip kucace kakhudlwana;Khomba kalula izinhlamvu kanye nokulandela indawo ebonakalayo.

Umshini wokubeka we-E1-V 0201 indinganiso yokuhlola yokupakisha yokuvala: Imishini efanayo 0201 iphayona lokubekwa.

I-IPC9850-0603 isivivinyo sesivinini sebhodi esijwayelekile: ukuhlolwa kwesivinini esingu-0603 kusetshenziswa ibhodi lokuhlola elijwayelekile lemboni ye-SMT.

I-IPC9850-QFP100 yokuhlola ukunemba kwebhodi elijwayelekile le-IC: ukuhlolwa kokunemba kwe-QFP100 kusetshenziswa ibhodi lokuhlola elijwayelekile lemboni ye-SMT.